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SN-D12B Datasheet(PDF) 9 Page - Fujitsu Component Limited.

No. de pieza SN-D12B
Descripción Electrónicos  SOLID STATE RELAY (I/O Module) MAXIMUM LOAD CURRENT 1 A
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Fabricante Electrónico  FUJITSU [Fujitsu Component Limited.]
Página de inicio  http://edevice.fujitsu.com/fmd/en/index.html
Logo FUJITSU - Fujitsu Component Limited.

SN-D12B Datasheet(HTML) 9 Page - Fujitsu Component Limited.

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9
SN SERIES
1. General Information
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
now.Mostofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfo.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
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LeadfreesolderpastecurrentlyusedinrelaysisSn-3.0Ag-0.5Cu.
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AllsignalandmostpowerrelaysalsocomplywithRoHS.Pleaserefertoindividualdata
sheets.RelaysthatareRoHScompliantdonotcontainthe5hazardousmaterialsthat
arerestrictedbyRoHSdirective(lead,mercury,chromiumIV,PBB,PBDE).
l
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems(compatible).
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“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).
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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
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Wewillshipleadedrelaysaslongastheleadedrelayinventoryexists.
Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)
2. Recommended Lead Free Solder Profile
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RecommendedsolderpasteSn-3.0Ag-0.5Cu.
RoHS Compliance and Lead Free Relay Information
Reflow Solder condition
3. Moisture Sensitivity
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MoistureSensitivityLevelstandardisnotapplicabletoelectromechanicalrealys.
4. Tin Whisker
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DippedSnAgCusolderisknownaslowrisktinwhisker.Noconsiderablelengthwhiskerwasfoundbyourin
housetest.
We highly recommend that you confirm your actual solder conditions
Flow Solder condition:
Pre-heating:
maximum 120˚C
Soldering:
dipwithin5sec.at
260˚C soler bath
Solder by Soldering Iron:
SolderingIron
Temperature: maximum 360˚C
Duration:
maximum3sec.


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