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CDCE62005RGZR Datasheet(PDF) 11 Page - Texas Instruments

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No. de pieza CDCE62005RGZR
Descripción Electrónicos  Five/Ten Output Clock Generator/Jitter Cleaner With Integrated Dual VCOs
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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CDCE62005RGZR Datasheet(HTML) 11 Page - Texas Instruments

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CDCE62005
www.ti.com
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
VCC
Supply voltage range(2)
-0.5 to 4.6
V
VI
Input voltage range(3)
–0.5 to VCC + 0.5
V
VO
Output voltage range(3)
–0.5 to VCC + 0.5
V
Input Current (VI < 0, VI > VCC)
±20
mA
Output current for LVPECL/LVCMOS Outputs (0 < VO < VCC)
±50
mA
TJ
Maximum junction temperature
125
°C
Tstg
Storage temperature range
–65 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2)
All supply voltages have to be supplied simultaneously.
(3)
The input and output negative voltage ratings may be exceeded if the input and output clamp–current ratings are observed.
THERMAL CHARACTERISTICS
Package Thermal Resistance for QFN (RGZ) Package
(1) (2)
AIRFLOW (lfm)
qJP (°C/W)
(3)
qJA (°C/W)
0
JEDEC Compliant Board (6X6 VIAs on PAD)
2
28.9
100
JEDEC Compliant Board (6X6 VIAs on PAD)
2
20.4
0
Recommended Layout (7X7 VIAs on PAD)
2
27.3
100
Recommended Layout (7X7 VIAs on PAD)
2
20.3
(1)
The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(2)
Connected to GND with 36 thermal vias (0,3 mm diameter).
(3)
qJP (Junction – Pad) is used for the QFN Package, because the main heat flow is from the Junction to the GND-Pad of the QFN.
Copyright © 2008–2010, Texas Instruments Incorporated
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