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FCR3.64MC5 Datasheet(PDF) 3 Page - TDK Electronics |
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FCR3.64MC5 Datasheet(HTML) 3 Page - TDK Electronics |
3 / 3 page (2/2) 002-01 / 20070815 / ef32_fcr.fm • All specifications are subject to change without notice. ELECTRICAL CHARACTERISTICS ∗ ±0.5% is standard. • These values are typical. Application frequency are also available. Please contact TDK. RELIABILITY AND TEST CONDITIONS The following test items are satisfied. (1) Oscillating frequency change: within ±0.25% (2) Resonant resistance change: within ±10 Ω (3) Appearance, serious abnormalities not to exist. SOLDERABILITY The lead wires are adopted Pb free plating wire to apply Pb free soldering. You can also use current Sn-Pb eutectic solder. RECOMMENDED SOLDERING CONDITIONS This is the fit product for flow soldering. FLOW SOLDERING CONDITION Part No. Oscillating frequency Fosc (MHz) Resonant impedance Ro( Ω) Initial Fosc tolerance∗ (%) Capacitance CL1/CL2 (pF) FCR ∗∗.∗MC5 type(Built-in loading type) FCR3.45MC5 3.45 20 ±0.5 30/30 FCR3.52MC5 3.52 20 ±0.5 30/30 FCR3.58MC5 3.58 20 ±0.5/0.3 30/30 FCR3.64MC5 3.64 20 ±0.5 30/30 FCR3.84MC5 3.84 20 ±0.5 30/30 FCR4.0MC5 4.00 20 ±0.5/0.3 30/30 FCR4.19MC5 4.19 20 ±0.5/0.3 30/30 FCR5.0MC5 5.00 20 ±0.5/0.3 30/30 FCR6.0MC5 6.00 20 ±0.5/0.3 30/30 FCR8.0MC5 8.00 30 ±0.5/0.3 20/20 FCR8.38MC5 8.38 30 ±0.5/0.3 20/20 FCR10.0MC5 10.00 30 ±0.5/0.3 20/20 FCR ∗∗.∗M5 type(External loading type) FCR3.45M5 3.45 20 ±0.5 FCR3.52M5 3.52 20 ±0.5 FCR3.58M5 3.58 20 ±0.5/0.3 FCR3.64M5 3.64 20 ±0.5 FCR3.84M5 3.84 20 ±0.5 FCR4.0M5 4.00 20 ±0.5/0.3 FCR4.19M5 4.19 20 ±0.5/0.3 FCR5.0M5 5.00 20 ±0.5/0.3 FCR6.0M5 6.00 20 ±0.5/0.3 FCR8.0M5 8.00 30 ±0.5/0.3 FCR8.38M5 8.38 30 ±0.5/0.3 FCR10.0M5 10.00 30 ±0.5/0.3 FCR ∗∗.∗M6 type(External loading type) FCR16.0M6 16.00 40 ±0.5 FCR18.0M6 18.00 40 ±0.5 FCR18.43M6 18.43 40 ±0.5 FCR24.0M6 24.00 40 ±0.5 FCR25.0M6 25.00 40 ±0.5 FCR33.86M6 33.86 40 ±0.5 FCR40.0M6 40.00 40 ±0.5 Test items Test conditions Low temperature storage characteristics Temperature: –40±3°C Time: 1000h High temperature storage characteristics Temperature: +85±2°C Time: 1000h Humidity resistance Humidity: 90 to 95(%)RH Temperature: 60±2°C Time: 100h Thermal shock –40°C (30min), 85°C (30min) x 100 cycles Soldering heat resistance Solder temperature: peak 260°C, 10s flow Drop Drop 3 times onto the concrete from a height of 1m Vibration Frequency: 10 ⇔55 ⇔10Hz/min Amplitude: 1.5mm X, Y and Z directions for 2h each Test conditions Test result With Rosin-ethanol 25% by weight,dip in Sn-Pb eutectic solder bath at 230±5°C for 3±0.5sec. or Pb free solder(Sn-3Ag-0.5Cu) bath at 245±2°C for 3±0.2sec. 95% minimum of surface should be covered by new solder. Heat-resistant temperature 260±5°C Heat-resistant time 10±1sec. Number of times 1time |
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