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FCR3.64MC5 Datasheet(PDF) 3 Page - TDK Electronics

No. de pieza FCR3.64MC5
Descripción Electrónicos  Ceramic Resonators
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Fabricante Electrónico  TDK [TDK Electronics]
Página de inicio  http://www.tdk.com
Logo TDK - TDK Electronics

FCR3.64MC5 Datasheet(HTML) 3 Page - TDK Electronics

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002-01 / 20070815 / ef32_fcr.fm
• All specifications are subject to change without notice.
ELECTRICAL CHARACTERISTICS
±0.5% is standard.
• These values are typical. Application frequency are also available. Please contact TDK.
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Oscillating frequency change: within ±0.25%
(2) Resonant resistance change: within ±10
(3) Appearance, serious abnormalities not to exist.
SOLDERABILITY
The lead wires are adopted Pb free plating wire to apply Pb free
soldering. You can also use current Sn-Pb eutectic solder.
RECOMMENDED SOLDERING CONDITIONS
This is the fit product for flow soldering.
FLOW SOLDERING CONDITION
Part No.
Oscillating frequency Fosc
(MHz)
Resonant impedance
Ro(
Ω)
Initial Fosc tolerance
(%)
Capacitance CL1/CL2
(pF)
FCR
∗∗.∗MC5 type(Built-in loading type)
FCR3.45MC5
3.45
20
±0.5
30/30
FCR3.52MC5
3.52
20
±0.5
30/30
FCR3.58MC5
3.58
20
±0.5/0.3
30/30
FCR3.64MC5
3.64
20
±0.5
30/30
FCR3.84MC5
3.84
20
±0.5
30/30
FCR4.0MC5
4.00
20
±0.5/0.3
30/30
FCR4.19MC5
4.19
20
±0.5/0.3
30/30
FCR5.0MC5
5.00
20
±0.5/0.3
30/30
FCR6.0MC5
6.00
20
±0.5/0.3
30/30
FCR8.0MC5
8.00
30
±0.5/0.3
20/20
FCR8.38MC5
8.38
30
±0.5/0.3
20/20
FCR10.0MC5
10.00
30
±0.5/0.3
20/20
FCR
∗∗.∗M5 type(External loading type)
FCR3.45M5
3.45
20
±0.5
FCR3.52M5
3.52
20
±0.5
FCR3.58M5
3.58
20
±0.5/0.3
FCR3.64M5
3.64
20
±0.5
FCR3.84M5
3.84
20
±0.5
FCR4.0M5
4.00
20
±0.5/0.3
FCR4.19M5
4.19
20
±0.5/0.3
FCR5.0M5
5.00
20
±0.5/0.3
FCR6.0M5
6.00
20
±0.5/0.3
FCR8.0M5
8.00
30
±0.5/0.3
FCR8.38M5
8.38
30
±0.5/0.3
FCR10.0M5
10.00
30
±0.5/0.3
FCR
∗∗.∗M6 type(External loading type)
FCR16.0M6
16.00
40
±0.5
FCR18.0M6
18.00
40
±0.5
FCR18.43M6
18.43
40
±0.5
FCR24.0M6
24.00
40
±0.5
FCR25.0M6
25.00
40
±0.5
FCR33.86M6
33.86
40
±0.5
FCR40.0M6
40.00
40
±0.5
Test items
Test conditions
Low temperature
storage characteristics
Temperature: –40±3°C
Time: 1000h
High temperature
storage characteristics
Temperature: +85±2°C
Time: 1000h
Humidity resistance
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 100h
Thermal shock
–40°C (30min), 85°C (30min) x 100 cycles
Soldering heat resistance
Solder temperature: peak 260°C, 10s flow
Drop
Drop 3 times onto the concrete from a
height of 1m
Vibration
Frequency: 10
55 10Hz/min
Amplitude: 1.5mm
X, Y and Z directions for 2h each
Test conditions
Test result
With Rosin-ethanol 25% by weight,dip in Sn-Pb
eutectic solder bath at 230±5°C for 3±0.5sec. or
Pb free solder(Sn-3Ag-0.5Cu) bath at 245±2°C
for 3±0.2sec.
95% minimum of
surface should be
covered by new solder.
Heat-resistant temperature
260±5°C
Heat-resistant time
10±1sec.
Number of times
1time


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