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REV. D

〇CAUTIONS

1) Absolute maximum ratings

There is possibility of destruction in using beyond the absolute maximum rating. In case of destruction,

a failure mode can not be defined (short mode or open mode). Therefore when special mode is

envisaged where absolute maximum rating may be exceeded, please take a physical safety measure

such as fuse.

2) Reverse connection of power supply connector

Reverse connection of power supply connector may break IC. Take a measure against reverse

connection destruction such as inserting a diode between power supply and Vcc terminal.

3) Power supply line

Back electromotive force causes regenerated current to power supply line, therefore take a measure

such as placing a capacitor between power supply and GND for routing regenerated current, and fully

ensure that the capacitor characteristics have no problem before determine a capacitor value

4) GND potential

Ensure that the potential of GND terminal is the minimum potential in any operating condition. Also

ensure that all terminals except GND terminal do not fall below GND voltage including transient

characteristics. However, it is possible that the motor output terminal may deflect below GND because

of influence by back electromotive force of motor. Malfunction may possibly occur depending on use

condition, environment, and property of individual motor. Please make fully confirmation that no

problem is found on operation of IC.

5) Thermal design

Consider the power dissipation under actual use condition and apply thermal design with sufficient

margin.

6) Mounting failures

In attaching IC to printed board, pay enough attention to the direction and dislocation of IC. Mounting

failures may break IC. In addition, destruction is also possible when circuit is shorted by foreign

substance brought between outputs or between output and power supply - GND.

7) Operation in strong electromagnetic field

Use in strong electromagnetic field may cause malfunction, please be careful.

8) ASO

Please consider that the output Tr does not exceed the absolute maximum rating and ASO.

9) Thermal shut down circuit

This IC has thermal shut down (TSD) circuit. Operation temperature is 175℃(typ.) and has a hysteresis

width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal

becomes an open state. TSD circuit is simply for the purpose of intercepting IC from overheating, and

not for protecting and assuring IC. Therefore do not continue to use IC thereafter with this circuit

operating and do not use IC assuming the operation of this circuit.

10) Inspection with a set board

When connecting a capacitor to a pin with low impedance in inspection on a set board, stress may

possibly be applied to IC, therefore be sure to apply discharging in each process. In attaching to and

detaching from jigs in inspection process, be sure to turn off power before connecting, and turn off

power before removing IC. In addition, apply grounding to assembling process as a measure of

anti-static electricity, and use full caution in transporting and storing.

11) GND wiring pattern

When there are small signal GND and large current GND, separate the large current GND pattern from

small signal GND pattern. It is recommended to apply one-point grounding at the reference point of the

set in order that resistance of wiring pattern and large current do not cause change of voltage of small

signal GND. Please be cautious not to fluctuate the wiring pattern of GND of external mounted parts.

12) Capacitor between output and GND

When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for

some cause, it is possible that the current charged in the capacitor may flow into the output resulting in

destruction. Keep the capacitor between output and GND below 100uF.

13) IC terminal input

When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above

Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of

IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction

as well as destruction in the last. Do not use in a manner where parasitic element is actuated.