www.ti.com

6

4

A

E

SN74AUC1G19

1-OF-2 DECODER/DEMULTIPLEXER

SCES626D – MARCH 2005 – REVISED APRIL 2007

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Reel of 3000

SN74AUC1G19YZPR

U5_

(Pb-free)

SON – DRY

Reel of 5000

SN74AUC1G19DRYR

PREVIEW

Reel of 3000

SN74AUC1G19DBVR

U19_

–40

°C to 85°C SOT (SOT-23) – DBV

Reel of 250

SN74AUC1G19DBVT

U19_

Reel of 3000

SN74AUC1G19DCKR

SOT (SC-70) – DCK

U5_

Reel of 250

SN74AUC1G19DCKT

SOT (SOT-553) – DRL

Reel of 4000

SN74AUC1G19DRLR

U5_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

(3)

DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

FUNCTION TABLE

INPUTS

OUTPUTS

E

A

L

L

L

H

L

H

H

L

H

X

H

H

LOGIC DIAGRAM (POSITIVE LOGIC)

2

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