Bump View

1

2

B

C

A

Laser Marking View

2

1

B

C

A

TPS22946

ORDERABLE PART NUMBER

–40°C to 85°C

WCSP – YZP (0.4-mm pitch)

Reel of 3000

TPS22946YZPR

_ _ 5 H _

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

The actual top-side marking has two preceding characters to denote year, month and one following character to designate the wafer

fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

YZP PACKAGE

TERMINALS ASSIGNMENTS

C

ON

OC

B

CL

GND

A

2

1

TERMINAL FUNCTIONS

TERMINAL

TYPE

DESCRIPTION

NO.

NAME

A1

O

Output of the power switch

B1

GND

–

Ground

Over-current output flag. Active-low open-drain output that indicates an over-current, supply

C1

OC

O

under-voltage, or over-temperature state.

C2

ON

I

On/off control input

Current limit selection. CL high is 155-mA current limit, CL low is 70-mA current limit, and CL floating is

B2

CL

I

30-mA current limit.

A2

I

Supply. Input to the power switch and the supply voltage for the device

2

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Product Folder Link(s): TPS22946