ADT7460

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2

Figure 1. Functional Block Diagram

INPUT

SIGNAL

CONDITIONING

AND

ANALOG

MULTIPLEXER

GND

SERIAL BUS

INTERFACE

SCL

SDA

VALUE AND

LIMIT

REGISTERS

LIMIT

COMPARATORS

INTERRUPT

STATUS

REGISTERS

BAND GAP

TEMP SENSOR

ADDRESS

POINTER

REGISTER

PWM

CONFIGURATION

REGISTERS

INTERRUPT

MASKING

D1+

D1–

D2+

D2–

THERMAL

PROTECTION

PERFORMANCE

MONITORING

PWM REGISTERS

AND

CONTROLLERS

PWM1

PWM2

PWM3

ACOUSTIC

ENHANCEMENT

CONTROL

BAND GAP

REFERENCE

10−BIT

ADC

ADT7460

AUTOMATIC

FAN SPEED

CONTROL

DYNAMIC

CONTROL

FAN SPEED

COUNTER

TACH1

TACH2

TACH3

TACH4

THERM

SMBALERT

SMBUS

ADDRESS

SELECTION

ADDR

SELECT

ADDR_EN

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

6.5

V

Voltage on Any Input or Output Pin

−0.3 to +6.5

V

Input Current at Any Pin

±5

mA

Package Input Current

±20

mA

150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature, Soldering

IR Reflow Peak Temperature

IR Reflow Peak Temperature for Pb−Free

Lead Temperature (Soldering, 10 sec)

220

260

300

°C

ESD Rating

1500

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE:

This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

Unit

16−lead QSOP

150

39

°C/W

1.