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CSD17301Q5A_10 Datasheet(Hoja de datos) 2 Page - Texas Instruments

No. de Pieza. CSD17301Q5A_10
Descripción  30V, N-Channel NexFET™ Power MOSFETs
Descarga  11 Pages
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Fabricante  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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CSD17301Q5A
SLPS215B – JANUARY 2010 – REVISED JULY 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Static Characteristics
BVDSS
Drain to Source Voltage
VGS = 0V, ID = 250mA
30
V
IDSS
Drain to Source Leakage Current
VGS = 0V, VDS = 24V
1
mA
IGSS
Gate to Source Leakage Current
VDS = 0V, VGS = +10 / –8V
100
nA
VGS(th)
Gate to Source Threshold Voltage
VDS = VGS, ID = 250mA
0.9
1.1
1.55
V
VGS = 3V, ID = 25A
2.9
3.7
m
RDS(on)
Drain to Source On Resistance
VGS = 4.5V, ID = 25A
2.3
3
m
VGS = 8V, ID = 25A
2
2.6
m
gfs
Transconductance
VDS = 15V, ID = 25A
149
S
Dynamic Characteristics
Ciss
Input Capacitance
2660
3480
pF
Coss
Output Capacitance
VGS = 0V, VDS = 15V, f = 1MHz
1420
1850
pF
Crss
Reverse Transfer Capacitance
80
105
pF
RG
Series Gate Resistance
1.3
2.6
Qg
Gate Charge Total (4.5V)
19
25
nC
Qgd
Gate Charge Gate to Drain
4.3
nC
VDS = 15V, ID = 25A
Qgs
Gate Charge Gate to Source
5.7
nC
Qg(th)
Gate Charge at Vth
2.9
nC
Qoss
Output Charge
VDS = 14V, VGS = 0V
35
nC
td(on)
Turn On Delay Time
10.7
ns
tr
Rise Time
16.2
ns
VDS = 15V, VGS = 4.5V, ID = 25A, RG = 2Ω
td(off)
Turn Off Delay Time
28
ns
tf
Fall Time
10.5
ns
Diode Characteristics
VSD
Diode Forward Voltage
ISD = 25A, VGS = 0V
0.8
1
V
Qrr
Reverse Recovery Charge
50
nC
VDD= 14V, IF = 25A, di/dt = 300A/ms
trr
Reverse Recovery Time
33
ns
THERMAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
MIN
TYP
MAX
UNIT
RqJC
Thermal Resistance Junction to Case(1)
2.2
°C/W
RqJA
Thermal Resistance Junction to Ambient(1)(2)
49
°C/W
(1)
RqJC is determined with the device mounted on a 1-inch
2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×
3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design.
(2)
Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
2
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Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CSD17301Q5A




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