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74CB3Q3257RGYRG4 Datasheet(PDF) 1 Page - Texas Instruments |
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74CB3Q3257RGYRG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 17 page www.ti.com FEATURES 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 S 1B1 1B2 1A 2B1 2B2 2A GND VCC OE 4B1 4B2 4A 3B1 3B2 3A DBQ, DGV, OR PW PACKAGE (TOP VIEW) RGY PACKAGE (TOP VIEW) 1 16 8 9 2 3 4 5 6 7 15 14 13 12 11 10 OE 4B1 4B2 4A 3B1 3B2 1B1 1B2 1A 2B1 2B2 2A DESCRIPTION/ORDERING INFORMATION SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 • Data and Control Inputs Provide Undershoot Clamp Diodes • High-Bandwidth Data Path (up to 500 MHz (1)) • Low Power Consumption (I CC = 0.7 mA Typ) • 5-V Tolerant I/Os With Device Powered Up or Powered Down • V CC Operating Range From 2.3 V to 3.6 V • Low and Flat ON-State Resistance (r on) • Data I/Os Support 0- to 5-V Signaling Levels Characteristics Over Operating Range (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) (r on = 4 Ω Typ) • Control Inputs Can Be Driven by TTL or • Rail-to-Rail Switching on Data I/O Ports 5-V/3.3-V CMOS Outputs – 0- to 5-V Switching With 3.3-V V CC • I off Supports Partial-Power-Down Mode Operation – 0- to 3.3-V Switching With 2.5-V V CC • Latch-Up Performance Exceeds 100 mA Per • Bidirectional Data Flow With Near-Zero JESD 78, Class II Propagation Delay • ESD Performance Tested Per JESD 22 • Low Input/Output Capacitance Minimizes Loading and Signal Distortion – 2000-V Human-Body Model (C io(OFF) = 3.5 pF Typ) (A114-B, Class II) • Fast Switching Frequency (f OE = 20 MHz Max) – 1000-V Charged-Device Model (C101) • Supports Both Digital and Analog (1) For additional information regarding the performance Applications: USB Interface, Differential characteristics of the CB3Q family, refer to the TI application Signal Interface, Bus Isolation, Low-Distortion report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008. Signal Gating ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN – RGY Tape and reel SN74CB3Q3257RGYR BU257 SSOP (QSOP) – DBQ Tape and reel SN74CB3Q3257DBQR BU257 –40 °C to 85°C TSSOP – PW Tape and reel SN74CB3Q3257PWR BU257 TVSOP – DGV Tape and reel SN74CB3Q3257DGVR BU257 (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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