0015477716 datasheet(4/4 Pages) MOLEX2 | 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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0015477716 Datasheet(PDF) 4 Page - Molex Electronics Ltd.

No. de pieza	0015477716

Descripción Electrónicos	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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Fabricante Electrónico	MOLEX2 [Molex Electronics Ltd.]

Página de inicio	http://www.molex.com

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0015477716 Datasheet(HTML) 4 Page - Molex Electronics Ltd.

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Número de pieza similar - 0015477716

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Molex Electronics Ltd.	0015477710	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477712	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015477714	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015477718	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015477718	28Kb / 2P	2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

Descripción similar - 0015477716

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Molex Electronics Ltd.	0015477764	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477726	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477766	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477750	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477762	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477740	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477710	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015800225	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	15-80-0305	40Kb / 2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477630	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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