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ISL54220 Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL54220 Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 18 page 4 FN6819.1 February 4, 2010 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.5V Input Voltages HSD2x, HSD1x (Note 6) . . . . . . . . . . . . . . - 0.3V to 6.5V SEL, OE (Note 6) . . . . . . . . . . . . . -0.3 to ((VDD) + 0.3V) Output Voltages D+, D- (Note 6) . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V Continuous Current (HSD2x, HSD1x) . . . . . . . . . . . ±40mA Peak Current (HSD2x, HSD1x) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . >6kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . >500V Charged Device Model . . . . . . . . . . . . . . . . . . . . . . >2kV Latch-up Tested per JEDEC; Class II Level A . . . . . at +85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 10 Ld µTQFN (Notes 8, 10) . . . . . . 160 105 10 Ld TDFN (Notes 8, 9) . . . . . . . . 55 18 10 Ld MSOP (Note 7, 10) . . . . . . . 165 65 Maximum Junction Temperature (Plastic Package). . +150°C Maximum Storage Temperature Range. . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C VDD Supply Voltage Range . . . . . . . . . . . . . . . 2.7V to 5.5V Logic Control Input Voltage . . . . . . . . . . . . . . . . 0V to VDD Analog Signal Range . . . . . . . . . . . . . . . . . . . . . 0V to VDD CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. Signals on HSD1x, HSD2x, D+,D- exceeding GND by specified amount are clamped. Signals on OE and SEL exceeding VDD or GND by specified amount are clamped. Limit current to maximum current ratings. 7. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 9. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 10. For θJC, the “case temp” location is the center of the package top. Electrical Specifications - 2.7V to 5.5V Supply Test Conditions: VDD = +3.3V, GND = 0V, VSELH = 1.4V, VSELL = 0.5V, VOEH =1.4V, VOEL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER TEST CONDITIONS TEMP (°C) MIN (Notes 12, 13) TYP MAX (Notes 12, 13) UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG VDD = VDD, SEL = 0V or VDD , OE = 0V Full 0 - VDD V ON-Resistance, rON (High-Speed) VDD = 2.7V, SEL = 0.5V or 1.4V, OE = 0.5V, IDx = 40mA, VHSD1x or VHSD2 x = 0V to 400mV (see Figure 3, Note 16) 25 - 6.7 8 Ω Full - - 10 Ω rON Matching Between Channels, ΔrON (High-Speed) VDD = 2.7V, SEL = 0.5V or 1.4V, OE = 0.5V, IDx = 40mA, V VHSD1x or VHSD2 x = Voltage at max rON, (Notes 15, 16) 25 - 0.117 0.45 Ω Full - - 0.55 Ω rON Flatness, RFLAT(ON) (High-Speed) VDD = 2.7V, SEL = 0.5V or 1.4V, OE = 0.5V, IDx = 40mA, VHSD1x or VHSD2 x = 0V to 400mV, (Notes 14, 16) 25 - 0.94 1.2 Ω Full - - 1.3 Ω OFF Leakage Current, IHSD1x(OFF) VDD = 5.5V, SEL = VDD and OE = 0V or OE = VDD, VDx =0.3V, 3.3V, VHSD1X = 3.3V, 0.3V, VHSD2x = 0.3V, 3.3V 25 -15 0.31 15 nA Full -20 - 20 nA ON Leakage Current, IHSD1x(ON) VDD = 5.5V, SEL = OE = 0V, VDx = 0.3V, 3.3V, VHSD1X = 0.3V, 3.3V, VHSD2x = 3.3V, 0.3V 25 -20 2.2 20 nA Full -25 - 25 nA OFF Leakage Current, IHSD2x(OFF) VDD = 5.5V, SEL = OE = 0V or OE = VDD, VDx = 3.3V, 0.3V, VHSD2x = 0.3V, 3.3V, VHSD1X = 3.3V, 0.3V 25 -15 0.26 15 nA Full -20 - 20 nA ISL54220 |
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