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ISL54209EVAL1Z Datasheet(PDF) 3 Page - Intersil Corporation |
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ISL54209EVAL1Z Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 19 page 3 FN6627.4 June 10, 2010 Pin Descriptions TDFN µTQFN 2.1mmx1.6mm µTQFN 1.8mmx1.4mm NAME FUNCTION 1 1 10 VDD Power Supply 2 2 1 IN Digital Control Input 3 3 2 COM- Voice and Data Common Pin 4 4 3 COM+ Voice and Data Common Pin 5 5 4 GND Ground Connection 6 6 5 R Audio Right Input 7 7 6 L Audio Left Input 8 8 7 D+ USB Differential Input 9 9 8 D- USB Differential Input 10 10 9 CTRL Digital Control Input (Audio Enable) PD - - PD Thermal Pad. Tie to Ground or Float Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL54209IRUZ-T (Notes 3, 4, 5) GF -40 to +85 10 Ld 2.1mmx1.6mm µTQFN L10.2.1x1.6A ISL54209IRU1Z-T (Notes 3, 4, 5) U4 -40 to +85 10 Ld 1.8mmx1.4mm µTQFN L10.1.8x1.4A ISL54209IRTZ-T (Notes 2, 4, 5) 4209 -40 to +85 10 Ld 3mmx3mm TDFN L10.3x3A ISL54209IRTZ (Notes 2, 5) 4209 -40 to +85 10 Ld 3mmx3mm TDFN L10.3x3A ISL54209EVAL1Z ISL54209 Eval Kit NOTES: 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. Please refer to TB347 for details on reel specifications. 5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54209. For more information on MSL please see techbrief TB363. ISL54209 |
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