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BUK9516-75B Datasheet(PDF) 2 Page - NXP Semiconductors |
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BUK9516-75B Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 15 page Philips Semiconductors BUK95/9616-75B TrenchMOS™ logic level FET Product data Rev. 01 — 23 April 2003 2 of 15 9397 750 11246 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 3. Limiting values Table 2: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage (DC) - 75 V VDGR drain-gate voltage (DC) RGS =20kΩ -75 V VGS gate-source voltage (DC) - ±15 V ID drain current (DC) Tmb =25 °C; VGS =5V; Figure 2 and 3 -67 A Tmb = 100 °C; VGS =5V; Figure 2 -47 A IDM peak drain current Tmb =25 °C; pulsed; tp ≤ 10 µs; Figure 3 - 270 A Ptot total power dissipation Tmb =25 °C; Figure 1 - 157 W Tstg storage temperature −55 +175 °C Tj junction temperature −55 +175 °C Source-drain diode IDR reverse drain current (DC) Tmb =25 °C - 67 A IDRM peak reverse drain current Tmb =25 °C; pulsed; tp ≤ 10 µs - 270 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy unclamped inductive load; ID =67A; VDS ≤ 75 V; VGS =5V; RGS =50 Ω; starting Tmb =25 °C - 140 mJ |
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