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BUK127-50DL Datasheet(PDF) 9 Page - NXP Semiconductors |
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BUK127-50DL Datasheet(HTML) 9 Page - NXP Semiconductors |
9 / 11 page Philips Semiconductors Product specification PowerMOS transistor BUK127-50DL Logic level TOPFET MECHANICAL DATA Fig.20. SOT223 surface mounting package 3. UNIT A1 bp cD E e1 HE Lp Qy w v REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.10 0.01 1.8 1.5 0.80 0.60 b1 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 2.3 e 4.6 7.3 6.7 1.1 0.7 0.95 0.85 0.1 0.1 0.2 DIMENSIONS (mm are the original dimensions) SOT223 SC-73 97-02-28 99-09-13 w M bp D b1 e1 e A A1 Lp Q detail X HE E v M A A B B c y 0 2 4 mm scale A X 13 2 4 Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223 3 For further information, refer to surface mounting instructions for SOT223 envelope. Epoxy meets UL94 V0 at 1/8". Net Mass: 0.11 g October 2001 9 Rev 1.011 |
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