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FAN3226CMPX Datasheet(PDF) 2 Page - Fairchild Semiconductor

No. de pieza FAN3226CMPX
Descripción Electrónicos  Dual 2A High-Speed, Low-Side Gate Drivers
Download  25 Pages
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Fabricante Electrónico  FAIRCHILD [Fairchild Semiconductor]
Página de inicio  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN3226CMPX Datasheet(HTML) 2 Page - Fairchild Semiconductor

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© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN3226 / FAN3227 / FAN3228 / FAN3229 • Rev. 1.0.6
2
Ordering Information
Part Number
Logic
Input
Threshold
Package
Packing Method
Quantity
per Reel
FAN3226CMPX
Dual Inverting Channels +
Dual Enable
CMOS
3x3mm MLP-8
Tape & Reel
3,000
FAN3226CMX
SOIC-8
Tape & Reel
2,500
FAN3226TMPX
TTL
3x3mm MLP-8
Tape & Reel
3,000
FAN3226TMX
SOIC-8
Tape & Reel
2,500
FAN3227CMPX
Dual Non-Inverting Channels
+ Dual Enable
CMOS
3x3mm MLP-8
Tape & Reel
3,000
FAN3227CMX
SOIC-8
Tape & Reel
2,500
FAN3227TMPX
TTL
3x3mm MLP-8
Tape & Reel
3,000
FAN3227TMX
SOIC-8
Tape & Reel
2,500
FAN3228CMPX
Dual Channels of Two-Input /
One-Output Drivers, Pin
Configuration 1
CMOS
3x3mm MLP-8
Tape & Reel
3,000
FAN3228CMX
SOIC-8
Tape & Reel
2,500
FAN3228TMPX
TTL
3x3mm MLP-8
Tape & Reel
3,000
FAN3228TMX
SOIC-8
Tape & Reel
2,500
FAN3229CMPX
Dual Channels of Two-Input /
One-Output Drivers, Pin
Configuration 2
CMOS
3x3mm MLP-8
Tape & Reel
3,000
FAN3229CMX
SOIC-8
Tape & Reel
2,500
FAN3229TMPX
TTL
3x3mm MLP-8
Tape & Reel
3,000
FAN3229TMX
SOIC-8
Tape & Reel
2,500
All standard Fairchild Semiconductor products are RoHS compliant and many are also “GREEN” or going green. For Fairchild’s
definition of “green” please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package Outlines
Figure 2. 3x3mm MLP-8 (Top View)
Figure 3. SOIC-8 (Top View)
Thermal Characteristics(1)
Package
ΘJL
(2)
ΘJT
(3)
ΘJA
(4)
ΨJB
(5)
ΨJT
(6)
Units
8-Lead 3x3mm Molded Leadless Package (MLP)
1.6
68
43
3.5
0.8
°C/W
8-Pin Small Outline Integrated Circuit (SOIC)
40
31
89
43
3.0
°C/W
Notes:
1.
Estimates derived from thermal simulation; actual values depend on the application.
2.
Theta_JL (
ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3.
Theta_JT (
ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4.
Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and
JESD51-7, as appropriate.
5.
Psi_JB (
ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
6.
Psi_JT (
ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.


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