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TEA1713T Datasheet(PDF) 8 Page - NXP Semiconductors

No. de pieza TEA1713T
Descripción Electrónicos  Resonant power supply control IC with PFC
Download  47 Pages
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Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
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TEA1713T Datasheet(HTML) 8 Page - NXP Semiconductors

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TEA1713T
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 February 2011
8 of 47
NXP Semiconductors
TEA1713T
Resonant power supply control IC with PFC
external diode DSUPHS. The voltage drop between SUPREG and SUPHS can be
minimized by carefully selecting the appropriate diode, especially when using large
MOSFETs and high switching frequencies.
7.2.4 High voltage supply input (pin SUPHV)
In a stand-alone power supply application, this pin is connected to the boost voltage.
CSUPIC and CSUPREG will be charged by the HV start-up source (which delivers a constant
current from SUPHV to SUPIC) via this pin.
Short-circuit protection on pin SUPIC (SCP-SUPIC; see Section 7.9) limits the dissipation
in the HV start-up source when SUPIC is shorted to ground and limits the current on
SUPHV (to Ired(SUPHV)) as long as the voltage on SUPIC is below Vscp(SUPIC).
Under normal operating conditions, the voltage on pin SUPIC will exceed Vscp(SUPIC) very
quickly after start-up and the HV start-up source will switch to the nominal current
Inom(SUPHV).
During start-up and restart, the HV start-up source will charge CSUPIC and regulate the
voltage on SUPIC by hysteretic control. So the start level has a small degree of hysteresis
Vstart(hys)(SUPIC). The HV start-up source switches-off when VSUPIC exceeds the start level
Vstart(hvd)(SUPIC). Current consumption through pin SUPHV will be low (Itko(SUPHV)).
Once start-up is complete and the HBC controller is operating, SUPIC can be supplied
from the auxiliary winding of the HBC transformer. In this operational state, the HV
start-up source is disabled.
7.3 Flow diagram
The operation of the TEA1713 can be divided into a number of states - see Figure 3. The
abbreviations used in Figure 3 are explained In Table 8.


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