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MCZ33880EG Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

No. de pieza MCZ33880EG
Descripción Electrónicos  Configurable Octal Serial Switch
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Fabricante Electrónico  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MCZ33880EG Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33880
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VDD Supply Voltage (1)
VDD
-0.3 to 7.0
VDC
CS, DI, DO, SCLK, IN5, IN6, and EN (1)
-0.3 to 7.0
VDC
VPWR Supply Voltage (1)
VPWR
-16 to 50
VDC
Drain 1–8 (2)
5.0 mA
≤ IOUT ≤ 0.3 A
-18 to 40
VDC
Source 1–8 (3)
5.0 mA
≤ IOUT ≤ 0.3 A
-28 to 40
VDC
Output Voltage Clamp Low-Side Drive (4)
VOC
40 to 55
VDC
Output Voltage Clamp High-Side Drive (4)
VOC
-15 to -25
VDC
Output Clamp Energy (5)
ECLAMP
50
mJ
ESD Voltage (6)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Maximum Junction Temperature
-40 to 150
°C
Power Dissipation (TA = 25°C) (7)
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
PD
1.3
1.7
W
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
RθJA
94
°C/W
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
RθJA
RθJL
70
18
°C/W
Peak Package Reflow Temperature During Reflow (8), (9)
TPPRT
Note 9
°C
Notes
1.
Exceeding these limits may cause malfunction or permanent damage to the device.
2.
Configured as low-side driver with 300 mA load as current limit.
3.
Configured as high-side driver with 300 mA load as current limit.
4.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
5.
Maximum output clamp energy capability at 150
°C junction temperature using single non-repetitive pulse method.
6.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed
in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
7.
Maximum power dissipation with no heatsink used.
8.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.


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