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MCZ33880EG Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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MCZ33880EG Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 25 page Analog Integrated Circuit Device Data Freescale Semiconductor 5 33880 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit VDD Supply Voltage (1) VDD -0.3 to 7.0 VDC CS, DI, DO, SCLK, IN5, IN6, and EN (1) – -0.3 to 7.0 VDC VPWR Supply Voltage (1) VPWR -16 to 50 VDC Drain 1–8 (2) 5.0 mA ≤ IOUT ≤ 0.3 A – -18 to 40 VDC Source 1–8 (3) 5.0 mA ≤ IOUT ≤ 0.3 A – -28 to 40 VDC Output Voltage Clamp Low-Side Drive (4) VOC 40 to 55 VDC Output Voltage Clamp High-Side Drive (4) VOC -15 to -25 VDC Output Clamp Energy (5) ECLAMP 50 mJ ESD Voltage (6) Human Body Model Machine Model VESD1 VESD2 ±2000 ±200 V Storage Temperature TSTG -55 to 150 °C Operating Case Temperature TC -40 to 125 °C Operating Junction Temperature TJ -40 to 150 °C Maximum Junction Temperature – -40 to 150 °C Power Dissipation (TA = 25°C) (7) 28 SOIC, Case 751F-05 32 SOIC, Case 1324-02 PD 1.3 1.7 W Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05 RθJA 94 °C/W Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02 Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02 RθJA RθJL 70 18 °C/W Peak Package Reflow Temperature During Reflow (8), (9) TPPRT Note 9 °C Notes 1. Exceeding these limits may cause malfunction or permanent damage to the device. 2. Configured as low-side driver with 300 mA load as current limit. 3. Configured as high-side driver with 300 mA load as current limit. 4. With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver. 5. Maximum output clamp energy capability at 150 °C junction temperature using single non-repetitive pulse method. 6. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 7. Maximum power dissipation with no heatsink used. 8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics. |
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