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ADP1875-1.0-EVALZ Datasheet(PDF) 6 Page - Analog Devices |
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ADP1875-1.0-EVALZ Datasheet(HTML) 6 Page - Analog Devices |
6 / 44 page ADP1874/ADP1875 Rev. 0 | Page 6 of 44 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VREG, VREG_IN, TRACK to PGND, GND −0.3 V to +6 V VIN, EN, PGOOD to PGND −0.3 V to +28 V FB, COMP, RES, SS to GND −0.3 V to (VREG + 0.3 V) DRVL to PGND −0.3 V to (VREG + 0.3 V) SW to PGND −2.0 V to +28 V BST to SW −0.6 V to (VREG + 0.3 V) BST to PGND −0.3 V to +28 V DRVH to SW −0.3 V to VREG PGND to GND ±0.3 V PGOOD Input Current 35 mA θJA (16-Lead QSOP) 4-Layer Board 104°C/W Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Maximum Soldering Lead Temperature (10 sec) 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to PGND. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA Unit θJA (16-Lead QSOP) 4-Layer Board 104° °C/W BOUNDARY CONDITION In determining the values given in Table 2 and Table 3, natural convection is used to transfer heat to a 4-layer evaluation board. ESD CAUTION |
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