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CAT24M01XI-T2 Datasheet(PDF) 3 Page - ON Semiconductor

No. de pieza CAT24M01XI-T2
Descripción Electrónicos  1 Mb I2C CMOS Serial EEPROM 256?묪yte Page Write Buffer
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Fabricante Electrónico  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
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CAT24M01XI-T2 Datasheet(HTML) 3 Page - ON Semiconductor

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Table 4. PIN IMPEDANCE CHARACTERISTICS
VCC = 1.8 V to 5.5 V, TA = −40°C to +85°C and VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.
Symbol
Parameter
Conditions
Max
Units
CIN (Note 4)
SDA I/O Pin Capacitance
VIN = 0 V
8
pF
CIN (Note 4)
Input Capacitance (other pins)
VIN = 0 V
6
pF
IWP, IA (Note 5)
WP Input Current, Address Input Current (A1, A2)
VIN < VIH, VCC = 5.5 V
75
mA
VIN < VIH, VCC = 3.3 V
50
VIN < VIH, VCC = 1.8 V
25
VIN > VIH
2
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
5. When not driven, the WP, A1, A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively
strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power,
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source.
Table 5. A.C. CHARACTERISTICS (Note 6)
VCC = 1.8 V to 5.5 V, TA = −40°C to +85°C and VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.
Symbol
Parameter
Standard
VCC = 1.8 V − 5.5 V
Fast
VCC = 1.8 V − 5.5 V
Fast−Plus
VCC = 2.5 V − 5.5 V
TA = −405C to +855C
Units
Min
Max
Min
Max
Min
Max
FSCL
Clock Frequency
100
400
1,000
kHz
tHD:STA
START Condition Hold Time
4
0.6
0.25
ms
tLOW
Low Period of SCL Clock
4.7
1.3
0.45
ms
tHIGH
High Period of SCL Clock
4
0.6
0.40
ms
tSU:STA
START Condition Setup Time
4.7
0.6
0.25
ms
tHD:DAT
Data In Hold Time
0
0
0
ms
tSU:DAT
Data In Setup Time
250
100
50
ns
tR (Note 7)
SDA and SCL Rise Time
1,000
300
100
ns
tF (Note 7)
SDA and SCL Fall Time
300
300
100
ns
tSU:STO
STOP Condition Setup Time
4
0.6
0.25
ms
tBUF
Bus Free Time Between
STOP and START
4.7
1.3
0.5
ms
tAA
SCL Low to Data Out Valid
3.5
0.9
0.40
ms
tDH
Data Out Hold Time
50
50
50
ns
Ti (Note 7)
Noise Pulse Filtered at SCL
and SDA Inputs
50
50
50
ns
tSU:WP
WP Setup Time
0
0
0
ms
tHD:WP
WP Hold Time
2.5
2.5
1
ms
tWR
Write Cycle Time
5
5
5
ms
tPU (Notes 7, 8)
Power-up to Ready Mode
0.1
0.1
0.1
ms
6. Test conditions according to “A.C. Test Conditions” table.
7. Tested initially and after a design or process change that affects this parameter.
8. tPU is the delay between the time VCC is stable and the device is ready to accept commands.
Table 6. A.C. TEST CONDITIONS
Input Levels
0.2 x VCC to 0.8 x VCC
Input Rise and Fall Times
≤ 50 ns
Input Reference Levels
0.3 x VCC, 0.7 x VCC
Output Reference Levels
0.5 x VCC
Output Load
Current Source: IL = 3 mA (VCC ≥ 2.5 V); IL = 1 mA (VCC < 2.5 V); CL = 100 pF


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