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REV. C

The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable

result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as

well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a

way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the VEE

(P substrate) voltage to input pins. Keep in mind that the IC may malfunction in strong magnetic fields.

8) Ground patterns

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing

a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations

caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND

wiring pattern of any external parts, either.

9) Applications or inspection processes where the potentials of the VCC pin and other pins may be reversed from their normal

states may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1,000μF or lower

in case VCC is shorted with the GND pin while the external capacitor is charged. It is recommended to insert a diode

for preventing back current flow in series with VCC or bypass diodes between VCC and each pin.

10) Thermal shutdown circuit (TSD)

This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within

the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power

dissipation limits, the attendant rise in the junction temperature (Tj) will trigger the TSD circuit to turn off all

output power elements.

The circuit automatically resets once the junction temperature (Tj) drops. Operation of the TSD circuit presumes that

the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit.

11) Overcurrent protection circuit (OCP)

The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity.

This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit

current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor

or other component. This protection circuits is effective in preventing damage due to sudden and unexpected accidents.

However, the IC should not be used in applications characterized by the continuous operation or transitioning of the

protection circuits. At the time of thermal designing, keep in mind that the current capacity has negative characteristics

to temperatures.

VCC

Bypass diode

Back current prevention diode

Pin

Parasitic elements

(Pin A)

Parasitic elements or

Transistors

(Pin B)

VEE

C

B

E

Resistor

Parasitic elements

(Pin A)

VEE

N

P

N

N

P+

P+

P

Parasitic elements

or Transistors

P substrate

VEE

N

P

N

N

P+

P+

(Pin B) C

B

E

Transistor (NPN)

N