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74LVC2G125GD Datasheet(PDF) 2 Page - NXP Semiconductors

No. de pieza 74LVC2G125GD
Descripción Electrónicos  Dual bus buffer/line driver; 3-state
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Fabricante Electrónico  NXP [NXP Semiconductors]
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74LVC2G125GD Datasheet(HTML) 2 Page - NXP Semiconductors

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74LVC2G125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 11 — 9 September 2010
2 of 22
NXP Semiconductors
74LVC2G125
Dual bus buffer/line driver; 3-state
3.
Ordering information
4.
Marking
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC2G125DP
−40 °Cto+125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74LVC2G125DC
−40 °Cto+125 °C
VSSOP8
plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
SOT765-1
74LVC2G125GT
−40 °Cto+125 °C
XSON8
plastic extremely thin small outline package; no leads;
8 terminals; body 1
× 1.95 × 0.5 mm
SOT833-1
74LVC2G125GF
−40 °C to +125 °C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.35
× 1 × 0.5 mm
SOT1089
74LVC2G125GD
−40 °Cto+125 °C
XSON8U
plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3
× 2 × 0.5 mm
SOT996-2
74LVC2G125GM
−40 °Cto+125 °C
XQFN8U
plastic extremely thin quad flat package; no leads;
8 terminals; UTLP based; body 1.6
× 1.6 × 0.5 mm
SOT902-1
74LVC2G125GN
−40 °C to +125 °C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.2
× 1.0 × 0.35 mm
SOT1116
74LVC2G125GS
−40 °C to +125 °C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.35
× 1.0 × 0.35 mm
SOT1203
Table 2.
Marking codes
Type number
Marking code[1]
74LVC2G125DP
V25
74LVC2G125DC
V25
74LVC2G125GT
V25
74LVC2G125GF
VM
74LVC2G125GD
V25
74LVC2G125GM
V25
74LVC2G125GN
VM
74LVC2G125GS
VM


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