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AD9642BCPZRL7-250 Datasheet(PDF) 8 Page - Analog Devices

No. de pieza AD9642BCPZRL7-250
Descripción Electrónicos  14-Bit, 170 MSPS/210 MSPS/250 MSPS, 1.8 V Analog-to-Digital Converter (ADC)
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD9642BCPZRL7-250 Datasheet(HTML) 8 Page - Analog Devices

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AD9642
Rev. 0 | Page 8 of 28
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to AGND
−0.3 V to +2.0 V
VIN+, VIN− to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND
−0.3 V to AVDD + 0.2 V
VCM to AGND
−0.3 V to AVDD + 0.2 V
CSB to AGND
−0.3 V to DRVDD + 0.3 V
SCLK to AGND
−0.3 V to DRVDD + 0.3 V
SDIO to AGND
−0.3 V to DRVDD + 0.3 V
D0−/D1−, D0+/D1+ Through
D12−/D13−, D12+/D13+ to AGND
−0.3 V to DRVDD + 0.3 V
DCO+, DCO− to AGND
−0.3 V to DRVDD + 0.3 V
Environmental
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for the
LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints, maximizing
the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
θJA1,2
θJC1,3
θJB1,4
Unit
0
37.1
3.1
20.7
°C/W
1.0
32.4
°C/W
32-Lead LFCSP
5 mm × 5 mm
(CP-32-12)
2.0
29.1
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow increases heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces—through holes, ground, and
power planes—reduces the θJA.
ESD CAUTION


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