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SM802101UMGR Datasheet(PDF) 4 Page - Micrel Semiconductor |
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SM802101UMGR Datasheet(HTML) 4 Page - Micrel Semiconductor |
4 / 12 page Micrel, Inc. SM802101 July 2011 4 M9999-072111-A hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Supply Voltage (VDD, VDDO1/2)......................................+4.6V Input Voltage (VIN).............................. −0.50V to VDD + 0.5V Lead Temperature (soldering, 20s)............................ 260°C Case Temperature ..................................................... 115°C Storage Temperature (Ts) ......................... −65°C to +150°C Operating Ratings (2) Supply Voltage (VDD, VDDO1/2)............ +2.375V to +3.465V Ambient Temperature (TA).......................–40°C to +85°C Junction Thermal Resistance (3) QFN ( θJA) Still-Air......................................................24°C/W QFN ( ψJB) Junction-to-Board ......................................8°C/W DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. Symbol Parameter Condition Min. Typ. Max. Units VDD, VDDO1/2 2.5V Operating Voltage 2.375 2.5 2.625 V VDD, VDDO1/2 3.3V Operating Voltage 3.135 3.3 3.465 V Eight Outputs enabled, 100MHz Outputs 50Ω to VSS 217 270 Eight Outputs enabled, 200MHz Outputs 50Ω to VSS 229 285 Four Outputs enabled, 100MHz Outputs 50Ω to VSS, OE1 or OE2 = 0 149 185 IDD Supply current VDD + VDDO Four Outputs enabled, 200MHz Outputs 50Ω to VSS, OE1 or OE2 =0 158 197 mA HCSL DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. RL = 50Ω to VSS Symbol Parameter Condition Min Typ. Max. Units VOH Output High Voltage 660 700 850 mV VOL Output Low Voltage −150 0 27 mV VCROSS Crossing Point Voltage 250 350 550 mV Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. 4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established. |
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