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TPS2066C Datasheet(PDF) 7 Page - Texas Instruments

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No. de pieza TPS2066C
Descripción Electrónicos  Dual Channel, Current-Limited, Power-Distribution Switches
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPS2066C Datasheet(HTML) 7 Page - Texas Instruments

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TPS2062C, TPS2066C
TPS2060C, TPS2064C
TPS2002C, TPS2003C
www.ti.com
SLVSAX6C – OCTOBER 2011 – REVISED JUNE 2012
DEVICE INFORMATION
PIN FUNCTIONS – MSOP-8 PACKAGES
NAME
TPS2066C/64C TPS2062C/60C
I/O
DESCRIPTION
GND
1
1
Pwr
Ground connection
IN
2
2
I
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to
GND close to the IC
EN1
3
-
I
Enable input channel 1, logic high turns on power switch
EN1
-
3
I
Enable input channel 1, logic low turns on power switch
EN2
4
-
I
Enable input channel 2, logic high turns on power switch
EN2
-
4
I
Enable input channel 2, logic low turns on power switch
FLT2
5
5
O
Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 2
OUT2
6
6
O
Power-switch output channel 2, connected to load
OUT1
7
7
O
Power-switch output channel 1, connected to load
FLT1
8
8
O
Active-low open-drain output, asserted during over-current, or overtemperature conditions on
channel 1
PowerPAD™
PAD
PAD
Pwr
Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect
PAD to GND plane as a heatsink.
PIN FUNCTIONS – SOIC-8 PACKAGES
NAME
TPS2066C
TPS2062C
I/O
DESCRIPTION
GND
1
1
Pwr
Ground connection
IN
2
2
I
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to
GND close to the IC
EN1
3
-
I
Enable input channel 1, logic high turns on power switch
EN1
-
3
I
Enable input channel 1, logic low turns on power switch
EN2
4
-
I
Enable input channel 2, logic high turns on power switch
EN2
-
4
I
Enable input channel 2, logic low turns on power switch
FLT2
5
5
O
Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 2
OUT2
6
6
O
Power-switch output channel 2, connected to load
OUT1
7
7
O
Power-switch output channel 1, connected to load
FLT1
8
8
O
Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 1
PIN FUNCTIONS – SON-10 PACKAGES
NAME
TPS2003C
TPS2002C
I/O
DESCRIPTION
GND
1
1
Pwr
Ground connection
IN
2, 3
2, 3
I
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to
GND close to the IC
EN1
4
I
Enable input channel 1, logic high turns on power switch
EN1
4
I
Enable input channel 1, logic low turns on power switch
EN2
5
I
Enable input channel 2, logic high turns on power switch
EN2
5
I
Enable input channel 2, logic low turns on power switch
FLT2
6
6
O
Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 2
NC
7
7
No connect – leave floating.
OUT2
8
8
O
Power-switch output channel 2, connect to load
OUT1
9
9
O
Power-switch output channel 1, connect to load
FLT1
10
10
O
Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 1
PowerPAD™
PAD
PAD
Pwr
Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect
PAD to GND plane as a heatsink.
Copyright © 2011–2012, Texas Instruments Incorporated
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Product Folder Link(s): TPS2062C TPS2066C TPS2060C TPS2064C TPS2002C TPS2003C


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