TPS2062C, TPS2066C

TPS2060C, TPS2064C

TPS2002C, TPS2003C

SLVSAX6C – OCTOBER 2011 – REVISED JUNE 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

MAXIMUM

OUTPUT

BASE PART

MSOP-8

OPERATING

ENABLE

MARKING

SOIC-8

SON-10

DISCHARGE

NUMBER

(DGN)

CURRENT

(D)

(DRC)

PowerPAD™

1

Low

Y

TPS2062C

√

√

–

VRBQ

1

High

Y

TPS2066C

√

√

–

VRDQ

1.5

Low

Y

TPS2060C

–

√

–

VRAQ

1.5

High

Y

TPS2064C

–

√

–

VRCQ

2

Low

Y

TPS2002C

–

–

√

VREQ

2

High

Y

TPS2003C

–

–

√

VRFQ

(1)

For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Package code for MSOP-8 is “DGN” and for SON is “DRC”.

(3)

“–” indicates the device is not available in this package.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

VALUE

UNIT

MIN

MAX

–0.3

6

V

Voltage range from IN to OUT

–6

6

V

Internally Limited

°C

Human Body Model

2

kV

ESD

Charged Device Model

500

V

8 / 15

kV

(1)

Absolute maximum ratings apply over recommended junction temperature range.

(2)

All voltages are with respect to GND unless otherwise noted.

(3)

See INPUT AND OUTPUT CAPACITANCE section.

(4)

THERMAL INFORMATION

D

DGN

DRC

UNITS

8 PINS

8 PINS

10 PINS

Junction-to-ambient thermal resistance

129.9

57.2

45.4

Junction-to-case (top) thermal resistance

83.5

110.5

58

Junction-to-board thermal resistance

70.4

60.7

21.1

°C/W

Junction-to-top characterization parameter

36.6

7.8

1.9

Junction-to-board characterization parameter

66.9

24

21.3

Junction-to-case (bottom) thermal resistance

n/a

14.3

9.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

2

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Product Folder Link(s): TPS2062C TPS2066C TPS2060C TPS2064C TPS2002C TPS2003C