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02011J680CAWTR Datasheet(PDF) 19 Page - AVX Corporation

No. de Pieza. 02011J680CAWTR
Descripción  Thin-Film Technology
Descarga  20 Pages
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Fabricante  AVX [AVX Corporation]
Página de inicio  http://www.avx.com
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02011J680CAWTR Datasheet(HTML) 19 Page - AVX Corporation

 
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23
1
Accu-F® / Accu-P®
Application Notes
PREHEAT & SOLDERING
The rate of preheat in production should not exceed 4°C/
second and a recommended maximum is about 2°C/second.
Temperature differential from preheat to soldering should not
exceed 100°C.
For further specific application or process advice, please consult
AVX.
COOLING
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should be
used.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 150°C is
required. The most preferable technique is to use hot air sol-
dering tools. Where a soldering iron is used, a temperature
controlled model not exceeding 30 watts should be used and
set to not more than 260°C.
RECOMMENDED SOLDERING
PROFILE
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are
thoroughly cleaned of flux residues, especially the space
beneath the device. Such residues may otherwise become
conductive and effectively offer a lossy bypass to the device.
Various recommended cleaning conditions (which must be
optimized for the flux system being used) are as follows:
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,
water and other standard PCB
cleaning liquids.
Ultrasonic conditions . . power-20w/liter max.
frequency-20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
Time . . . . . . . . . . . . . . . 5 minutes max.
STORAGE CONDITIONS
Recommended
storage
conditions
for
Accu-F®
and
Accu-P® prior to use are as follows:
Temperature . . . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . . .
≤65%
Air Pressure . . . . . . . . . . 860mbar to 1060mbar
220
210
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
00.5
11.5
22.5
33.5
44.5
Assembly enters the
preheat zone
Additional soak time
to allow uniform
heating of the
substrate
Soak time
1) Activates the flux
2) Allows center of board
temperatures to catch up with
corners
45-60 sec.
above solder
melting point
Assembly exits heat–
no forced cooldown
186
°C solder melting
temperature
Time (mins)
0
2030405060708090
100
110
120
260
240
220
200
180
160
140
120
100
80
60
40
20
Time (seconds)
Enter Wave
Natural
Cooling
100
°C
3–5 seconds
10
0
20
40
60
80
100
120
140
160
180
200
215
°C
Time (minutes)
Preheat
Transfer from
preheat with
min. delay &
temp. loss
0
20
40
60
80
100
120
140
160
180
215
°C
Time (seconds)
Reflow
Enter
Vapor
Natural
Cooling
Duration varies
with thermal mass
of assembly
10–60 secs typical
10
20
30
40
50
60
70
200
IR REFLOW
WAVE SOLDERING
VAPOR PHASE


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