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02011J680JBTTR Datasheet(PDF) 17 Page - AVX Corporation |
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02011J680JBTTR Datasheet(HTML) 17 Page - AVX Corporation |
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17 / 20 page  21 1 CAPACITOR TYPE CHIP SIZE THERMAL IMPEDANCE (°C/W) Accu-P ® 0805 6.5 1210 5 Microwave MLC 0505 12 1210 7.5 ADVANTAGES OF ACCU-P ® IN RF POWER CIRCUITS The optimized design of Accu-P® offers the designer of RF power circuits the following advantages: • Reduced power losses due to the inherently low ESR of Accu-P®. • Increased power dissipation due to the high thermal conductivity of Accu-P®. PRACTICAL APPLICATION IN RF POWER CIRCUITS • There is a wide variety of different experimental methods for measuring the power handling performance of a capacitor in RF power circuits. Each method has its own problems and few of them exactly reproduce the conditions present in “real” circuit applications. • Similarly, there is a very wide range of different circuit appli- cations, all with their unique characteristics and operating conditions which cannot possibly be covered by such “theoretical” testing. • THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR APPLICATION IS ITS PERFORMANCE UNDER OPERATING CONDITIONS IN THE ACTUAL CIRCUIT. Accu-F® / Accu-P® Performance Characteristics RF Power Applications RF POWER APPLICATIONS In RF power applications capacitor losses generate heat. Two factors of particular importance to designers are: • Minimizing the generation of heat. • Dissipating heat as efficiently as possible. CAPACITOR HEATING • The major source of heat generation in a capacitor in RF power applications is a function of RF current (I) and ESR, from the relationship: Power dissipation = I2 RMS x ESR • Accu-P® capacitors are specially designed to minimize ESR and therefore RF heating. Values of ESR for Accu-P® capacitors are significantly less than those of ceramic MLC components currently available. HEAT DISSIPATION • Heat is dissipated from a capacitor through a variety of paths, but the key factor in the removal of heat is the thermal conductivity of the capacitor material. • The higher the thermal conductivity of the capacitor, the more rapidly heat will be dissipated. • The table below illustrates the importance of thermal conductivity to the performance of Accu-P® in power applications. 1210 0805 Amps 8 6 4 2 0 0 200 400 600 800 1000 1200 1400MHz 1210 0805 0603 0402 PRODUCT MATERIAL THERMAL CONDUCTIVITY W/mK Accu-P® Alumina 18.9 Microwave MLC Magnesium Titanate 6.0 Power Handling Accu-P® 10pF Data used in calculating the graph: Thermal impedance of capacitors: 0402 17°C/W 0603 12°C/W 0805 6.5°C/W 1210 5°C/W Thermal impedance measured using RF generator, amplifier and strip-line transformer. ESR of capacitors measured on Boonton 34A THERMAL IMPEDANCE Thermal impedance of Accu-P® chips is shown below com- pared with the thermal impedance of Microwave MLC’s. The thermal impedance expresses the temperature difference in °C between chip center and termination caused by a power dissipation of 1 watt in the chip. It is expressed in °C/W. |
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