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TPS2530DBVR Datasheet(PDF) 10 Page - Texas Instruments |
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TPS2530DBVR Datasheet(HTML) 10 Page - Texas Instruments |
10 / 17 page I OS I OS I OC V IN V IN I OUT I OUT Decreasing Load Resistance Decreasing Load Resistance Flat Current Limit Current Limit with Peaking 0 A 0 A 0 V 0 V Slope = –R DS(on) Slope = –R DS(on) TPS2530 SLUSB67 – AUGUST 2012 www.ti.com There are two kinds of current limit profiles typically available in TI switch products similar to the TPS2530. Many older designs have an output I vs V characteristic similar to the plot labeled “Current Limit with Peaking” in Figure 21. This type of limiting can be characterized by two parameters, the current limit corner (IOC), and the short circuit current (IOS). IOC is often specified as a maximum value. The TPS2530 does not present noticeable peaking in the current limit, corresponding to the characteristic labeled “Flat Current Limit” in Figure 21. This is why the IOC parameter is not present in the Electrical Characteristics tables. Figure 21. Current Limit Profiles FLT The FLT open-drain output is asserted (active low) during an over-load or over-temperature condition. A 8 ms deglitch on both the rising and falling edged avoids false reporting at startup and during transients. A current limit condition shorter than the deglitch period clears the internal timer upon termination. The deglitch timer will not integrate with excessive ripple and large output capacitance may interface with operation of FLT around IOS as the ripple will drive the TPS2530 in and out of current limit. If the TPS2530 is in current limit and the over-temperature circuit goes active, FLT goes true immediately however exiting this condition is deglitched. FLT is tripped just as the knee of the constant-current limiting is entered. Disabling the TPS2530 clears and active FLT as soon as the switch turns off. FLT is high impedance when the TPS2530 is disabled or in undervoltage lockout (UVLO). APPLICATION INFORMATION INPUT AND OUTPUT CAPACITANCE Input and output capacitance improves the performance of the device. The actual capacitance should be optimized for the particular application. For all applications, a 0.1 µF or greater ceramic bypass capacitor between IN and GND is recommended as close to the device as possible for local noise de-coupling. All protection circuits such as TPS2530 will have the potential for input voltage overshoots and output voltage undershoots. Input voltage overshoots can be caused by either of two effects. The first cause is an abrupt application of input voltage in conjunction with input power bus inductance and input capacitance when the IN terminal is high impedance (before turn on). Theoretically, the peak voltage is 2 times the applied. The second cause is due to the abrupt reduction of output short circuit current when the TPS2530 turns off and energy stored in the input inductance drives the input voltage high. Input voltage droops may also occur with large load steps and as the TPS2530 output is shorted. Applications with large input inductance (e.g. connecting the evaluation board to the bench power-supply through long cables) may require large input capacitance reduce the voltage overshoot from exceeding the absolute maximum voltage of the device. The fast current-limit speed of the TPS2530 to hard output short circuits isolate the input bus form faults. However, ceramic input capacitance in the range of 1 µF to 22 µF adjacent to the TPS2530 input aids in both speeding response time and limiting the transient seen on the input power bus. Momentary input transients to 6.5 V are permitted. In order to keep front-end power circuit work normally, it is better to increase the output cap. 10 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links :TPS2530 |
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