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SN74AUP2G17DRYR Datasheet(PDF) 2 Page - Texas Instruments |
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SN74AUP2G17DRYR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 21 page 1A 1Y 1 6 2A 2Y 3 4 SN74AUP2G17 SCES750A – SEPTEMBER 2009 – REVISED MAY 2010 www.ti.com The SN74AUP2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) (2) TA PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoStar™ – WCSP (DSBGA) Reel of 3000 SN74AUP2G17YFPR _ _ _ H 7 _ 0.23-mm Large Bump – YFP (Pb-free) QFN – DSF Reel of 5000 SN74AUP2G17DSFR HL –40°C to 85°C uQFN – DRY Reel of 5000 SN74AUP2G17DRYR HL SOT (SC-70) – DCK Reel of 3000 SN74AUP2G17DCKR HL_ (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE (Each Inverter) INPUT OUTPUT A Y H H L L LOGIC DIAGRAM (POSITIVE LOGIC) 2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G17 |
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