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TPS62151 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS62151 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 33 page  TPS62150 TPS62151, TPS62152, TPS62153 SLVSAL5 – NOVEMBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1) TA OUTPUT VOLTAGE PART NUMBER(2) PACKAGE ORDERING PACKAGE MARKING adjustable TPS62150 TPS62150RGT QUA 1.8 V TPS62151 TPS62151RGT QWO -40 °C to 85°C 16-Pin QFN 3.3 V TPS62152 TPS62152RGT QWP 5.0 V TPS62153 TPS62153RGT QWQ (1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet. (2) Contact the factory to check availability of other fixed output voltage versions. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT AVIN, PVIN -0.3 20 V EN, SS/TR -0.3 VIN+0.3 Pin voltage range(2) SW -0.3 VIN+0.3 V DEF, FSW, FB, PG, VOS -0.3 7 V Power Good sink current PG 10 mA Operating junction temperature range, TJ -40 125 Temperature range °C Storage temperature range, Tstg -65 150 HBM Human body model 2 kV ESD rating(3) CDM Charge device model 0.5 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. (3) ESD testing is performed according to the respective JESD22 JEDEC standard. THERMAL INFORMATION TPS6215X THERMAL METRIC(1) RGT UNITS 14 PINS θJA Junction-to-ambient thermal resistance 29.1 θJC(TOP) Junction-to-case(top) thermal resistance 15 θJB Junction-to-board thermal resistance 11 °C/W ψJT Junction-to-top characterization parameter 0.5 ψJB Junction-to-board characterization parameter 10 θJC(BOTTOM) Junction-to-case(bottom) thermal resistance 3.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT Supply Voltage, VIN (at AVIN and P VIN) 3 17 V Operating free air temperature, TA –40 85 °C Operating junction temperature, TJ –40 125 °C 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS62150 TPS62151 TPS62152 TPS62153 |
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