TPS652510

SLVSB30A

– SEPTEMBER 2011 – REVISED SEPTEMBER 2011

www.ti.com

The device incorporates an overvoltage transient protection circuit to minimize voltage overshoot. The OVP

feature minimizes the output overshoot by implementing a circuit to compare the FB pin voltage to OVP threshold

which is 109% of the internal voltage reference. If the FB pin voltage is greater than the OVTP threshold, the

high side MOSFET is disabled preventing current from flowing to the output and minimizing output overshoot.

When the FB voltage drops lower than the OVP lower threshold which is 107%, the high side MOSFET is

allowed to turn on the next clock cycle.

TPS652510 features a supervisor circuit which monitors each buck

’s output and the PGOOD pin is asserted

once sequencing is done. The PGOOD pin is an open drain output. The PGOOD pin is pulled low when any

buck converter is pulled below 85% of the nominal output voltage. The PGOOD is pulled up when all converter

outputs are more than 90% of its nominal output voltage. The default reset time is 100 ms. The polarity of the

PGOOD is active high.

The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 160

°C.

The thermal shutdown forces the device to stop operating when the junction temperature exceeds thermal trip

threshold. Once the die temperature decreases below 140

°C, the device reinitiates the power up sequence. The

thermal shutdown hysteresis is 20

°C.

PART NUMBER

TOP-SIDE MARKING

-40

°C to 125°C

40-Pin (QFN) - RHA

Reel of 2500

TPS652510RHAR

TPS652510

(1)

For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

2

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© 2011, Texas Instruments Incorporated

Product Folder Link(s): TPS652510