TPS2511

SLUSB18 – JUNE 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE

TRANSPORT

MINIMUM

TOP-SIDE

PACKAGE

PINS

DEVICE

MEDIA

QUANTITY

MARKING

NUMBER

Tube

80

TPS2511DGN

2511

–40°C to 85°C

MSOP (DGN)

8

Tape and Reel

2500

TPS2511DGNR

2511

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

Over recommended junction temperature range, voltages are referenced to GND (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage range

IN

–0.3

7

Input voltage range

EN, ILIM_SET

–0.3

7

Voltage range

OUT, CS

–0.3

7

V

IN to OUT

–7

7

DP output voltage, DM output voltage

–0.3

IN+0.3 or 5.7

DP input voltage, DM input voltage

–0.3

IN+0.3 or 5.7

Continuous output sink current

DP input current, DM input current

35

Continuous output source

DP output current, DM output current

35

current

mA

Continuous output sink current

CS

10

Continuous output source

ILIM_SET

Internally limited

current

IN, OUT, EN, ILIM_SET, CS

2

Human Body Model (HBM)

kV

ESD rating

DP, DM

7.5

Charging Device Model (CDM)

500

V

Internally limited

–65

150

°C

THERMAL INFORMATION

TPS2511

UNITS

DGN (8 PINS)

Junction-to-ambient thermal resistance

65.2

Junction-to-case (top) thermal resistance

53.3

Junction-to-board thermal resistance

36.9

°C/W

Junction-to-top characterization parameter

3.9

Junction-to-board characterization parameter

36.6

Junction-to-case (bottom) thermal resistance

13.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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