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TPS2511DGN Datasheet(PDF) 2 Page - Texas Instruments |
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TPS2511DGN Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page TPS2511 SLUSB18 – JUNE 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) ORDERABLE TRANSPORT MINIMUM TOP-SIDE TA PACKAGE PINS DEVICE MEDIA QUANTITY MARKING NUMBER Tube 80 TPS2511DGN 2511 –40°C to 85°C MSOP (DGN) 8 Tape and Reel 2500 TPS2511DGNR 2511 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS Over recommended junction temperature range, voltages are referenced to GND (unless otherwise noted) MIN MAX UNIT Supply voltage range IN –0.3 7 Input voltage range EN, ILIM_SET –0.3 7 Voltage range OUT, CS –0.3 7 V IN to OUT –7 7 DP output voltage, DM output voltage –0.3 IN+0.3 or 5.7 DP input voltage, DM input voltage –0.3 IN+0.3 or 5.7 Continuous output sink current DP input current, DM input current 35 Continuous output source DP output current, DM output current 35 current mA Continuous output sink current CS 10 Continuous output source ILIM_SET Internally limited current IN, OUT, EN, ILIM_SET, CS 2 Human Body Model (HBM) kV ESD rating DP, DM 7.5 Charging Device Model (CDM) 500 V Operating junction temperature, TJ Internally limited Storage temperature range, Tstg –65 150 °C THERMAL INFORMATION TPS2511 THERMAL METRIC(1) UNITS DGN (8 PINS) θJA Junction-to-ambient thermal resistance 65.2 θJCtop Junction-to-case (top) thermal resistance 53.3 θJB Junction-to-board thermal resistance 36.9 °C/W ψJT Junction-to-top characterization parameter 3.9 ψJB Junction-to-board characterization parameter 36.6 θJCbot Junction-to-case (bottom) thermal resistance 13.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS2511 |
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