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TPS40200QDRQ1 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS40200QDRQ1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 41 page TPS40200-Q1 SLUS739D – SEPTEMBER 2006 – REVISED JULY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Table 1. ORDERING INFORMATION(1) OUTPUT TA PACKAGE(2) PART NUMBER MEDIUM QUANTITY VOLTAGE –40°C to 125°C Adjustable Plastic small outline (D) TPS40200QDRQ1 Tape and reel 2500/Reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Electrostatic Discharge (ESD) Protection MIN MAX UNIT Human-Body Model (HBM) 1000 V Charged-Device Model (CDM) 1500 V Machine Model (MM) 100 V Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) TPS40200 UNIT VDD, ISNS 52 Input voltage range RC, FB –0.3 to 5.5 V SS –0.3 to 9.0 COMP –0.3 to 9.0 Output voltage range V GDRV (VIN – 10) to VIN Tstg Storage temperature range –55 to 150 °C Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C Recommended Operating Conditions MIN MAX UNIT VDD Input voltage 4.5 52 V TA Operating temperature –40 125 °C Thermal Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TYP UNIT θJC Thermal resistance, junction to case(1) 49 °C/W (1) TI uses test boards designed to JESD 51-3 and JESD 51-7 for thermal-impedance measurements. The parameters outlined in these standards are also used to set up thermal models. TI uses the thermal-model program ThermCAL, a finite-difference thermal-modeling tool. Using this test procedure, the junction-to-case thermal resistance of this part is 49 °C/W. 2 Copyright © 2006–2011, Texas Instruments Incorporated |
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