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TPS40200QDRQ1 Datasheet(PDF) 2 Page - Texas Instruments

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No. de pieza TPS40200QDRQ1
Descripción Electrónicos  WIDE-INPUT-RANGE NONSYNCHRONOUS VOLTAGE-MODE CONTROLLER
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPS40200QDRQ1 Datasheet(HTML) 2 Page - Texas Instruments

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TPS40200-Q1
SLUS739D
– SEPTEMBER 2006 – REVISED JULY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. ORDERING INFORMATION(1)
OUTPUT
TA
PACKAGE(2)
PART NUMBER
MEDIUM
QUANTITY
VOLTAGE
–40°C to 125°C
Adjustable
Plastic small outline (D)
TPS40200QDRQ1
Tape and reel
2500/Reel
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Electrostatic Discharge (ESD) Protection
MIN
MAX
UNIT
Human-Body Model (HBM)
1000
V
Charged-Device Model (CDM)
1500
V
Machine Model (MM)
100
V
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
TPS40200
UNIT
VDD, ISNS
52
Input voltage range
RC, FB
–0.3 to 5.5
V
SS
–0.3 to 9.0
COMP
–0.3 to 9.0
Output voltage range
V
GDRV
(VIN – 10) to VIN
Tstg
Storage temperature range
–55 to 150
°C
Lead temperature 1,6 mm (1/16 in) from case for 10 s
260
°C
Recommended Operating Conditions
MIN
MAX
UNIT
VDD
Input voltage
4.5
52
V
TA
Operating temperature
–40
125
°C
Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TYP
UNIT
θJC
Thermal resistance, junction to case(1)
49
°C/W
(1)
TI uses test boards designed to JESD 51-3 and JESD 51-7 for thermal-impedance measurements. The parameters outlined in these
standards are also used to set up thermal models. TI uses the thermal-model program ThermCAL, a finite-difference thermal-modeling
tool. Using this test procedure, the junction-to-case thermal resistance of this part is 49
°C/W.
2
Copyright
© 2006–2011, Texas Instruments Incorporated


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