1,213

1,193

1,213

1,193

TPS7510x

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SBVS080H – SEPTEMBER 2006 – REVISED JANUARY 2010

Figure 14. YFF Wafer Chip-Scale Package Dimensions (in mm)

space

REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (March. 2009) to Revision H

Page

•

Added DSK package dissipation information to Dissipation Ratings table ........................................................................... 2

•

for YFF and DSK packages .................................................................................................................................................. 3

•

Added YFF and DSK package specifications for current matching parameter, Electrical Characteristics ........................... 3

•

Changed diode current accuracy parameter, Electrical Characteristics, to reflect YFF and DSK package

specifications ........................................................................................................................................................................ 3

•

Deleted operating junction temperature range specification from Electrical Characteristics table to eliminate

redundancy ........................................................................................................................................................................... 3

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