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TPS76901SKGD1 Datasheet(PDF) 10 Page - Texas Instruments |
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TPS76901SKGD1 Datasheet(HTML) 10 Page - Texas Instruments |
10 / 21 page 100 1000 10000 100000 1000000 10000000 100 110 120 130 140 150 160 170 180 Continuous TJ (°C) Wirebond Voiding Fail Mode TPS76901-HT SLVS959C – JUNE 2009 – REVISED APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Note: 1. See datasheet for absolute maximum and minimum recommended operating conditions. 2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). Figure 5. TPS76901HDBVT Operating Life Derating Chart 10 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Product Folder Link(s): TPS76901-HT |
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