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SST89E554-25-C-TQI Datasheet(PDF) 47 Page - Silicon Storage Technology, Inc

No. de pieza SST89E554-25-C-TQI
Descripción Electrónicos  FlashFlex51 MCU
Download  58 Pages
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Fabricante Electrónico  SST [Silicon Storage Technology, Inc]
Página de inicio  http://www.sst.com/
Logo SST - Silicon Storage Technology, Inc

SST89E554-25-C-TQI Datasheet(HTML) 47 Page - Silicon Storage Technology, Inc

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Preliminary Specifications
FlashFlex51 MCU
SST89E564 / SST89V564 / SST89E554 / SST89V554
47
©2001 Silicon Storage Technology, Inc.
S71181-03-000
9/01
384
10.0 ELECTRICAL SPECIFICATION
Note: This specification contains preliminary information on new products in production.
The specifications are subject to change without notice.
10.1 Operation Range
10.2 Reliability Characteristics
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to + 150°C
Voltage on EA# Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
Transient Voltage (<20ns) on Any Other Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +6.5V
Maximum IOL per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Maximum IOL per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
TABLE
10-1: OPERATING RANGE
Symbol
Description
Min.
Max
Unit
Ta
Ambient Temperature Under Bias
Standard
0
+70
°C
Industrial
-40
+85
°C
VDD
Supply Voltage
2.7
5.5
V
fOSC
Oscillator Frequency
For In-Application Programming
040
MHz
0.25
40
MHz
T10-1.1 384
TABLE
10-2: RELIABILITY CHARACTERISTICS
Symbol
Parameter
Minimum Specification
Units
Test Method
NEND1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Endurance
10,000
Cycles
JEDEC Standard A117
TDR1
Data Retention
100
Years
JEDEC Standard A103
ILTH1
Latch Up
100 + IDD
mA
JEDEC Standard 78
T10-2.0 384


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