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TPS70919DBVR Datasheet(PDF) 7 Page - Texas Instruments

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No. de pieza TPS70919DBVR
Descripción Electrónicos  150-mA, 30-V, UltraLow IQ, Low-Dropout Regulators with Enable
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS70919DBVR Datasheet(HTML) 7 Page - Texas Instruments

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TPS709xx
www.ti.com
SBVS186 – MARCH 2012
THERMAL INFORMATION
Thermal protection disables the output when the junction temperature rises to approximately +165°C, allowing
the device to cool. When the junction temperature cools to approximately +145°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a
result of overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to +125°C, maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least +35°C above the maximum expected ambient condition of the particular application. This
configuration produces a worst-case junction temperature of +125°C at the highest expected ambient
temperature and worst-case load.
The TPS709xx internal protection circuitry is designed to protect against overload conditions. It is not intended to
replace proper heatsinking. Continuously running the TPS709xx into thermal shutdown degrades device
reliability.
POWER DISSIPATION
The ability to remove heat from the die is different for each package type, which presents different considerations
in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components
moves the heat from the device to ambient air. Performance data for JEDEC low and high-K boards are given in
the Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the
device. The addition of plated through-holes to heat-dissipating layers also improves the heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of
the output current and the voltage drop across the output pass element, as shown in Equation 1:
PD = (VIN – VOUT) × IOUT
(1)
Copyright © 2012, Texas Instruments Incorporated
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