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TPS70919DBVR Datasheet(PDF) 7 Page - Texas Instruments |
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TPS70919DBVR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 11 page TPS709xx www.ti.com SBVS186 – MARCH 2012 THERMAL INFORMATION Thermal protection disables the output when the junction temperature rises to approximately +165°C, allowing the device to cool. When the junction temperature cools to approximately +145°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to +125°C, maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least +35°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of +125°C at the highest expected ambient temperature and worst-case load. The TPS709xx internal protection circuitry is designed to protect against overload conditions. It is not intended to replace proper heatsinking. Continuously running the TPS709xx into thermal shutdown degrades device reliability. POWER DISSIPATION The ability to remove heat from the die is different for each package type, which presents different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to ambient air. Performance data for JEDEC low and high-K boards are given in the Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improves the heatsink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element, as shown in Equation 1: PD = (VIN – VOUT) × IOUT (1) Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 7 |
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