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ADG5409BRUZ-REEL7 Datasheet(PDF) 10 Page - Analog Devices

No. de pieza ADG5409BRUZ-REEL7
Descripción Electrónicos  High Voltage Latch-Up Proof, 4-/8-Channel Multiplexers
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADG5409BRUZ-REEL7 Datasheet(HTML) 10 Page - Analog Devices

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ADG5408/ADG5409
Data Sheet
Rev. B | Page 10 of 24
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
EN
VSS
S1
S4
S3
S2
A0
A2
GND
VDD
S7
D
S8
S6
S5
A1
ADG5408
TOP VIEW
(Not to Scale)
Figure 2. ADG5408 Pin Configuration (TSSOP)
1
VSS
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, VSS.
2
S1
3
S2
4
S3
11 VDD
12 GND
10 S5
9
S6
TOP VIEW
(Not to Scale)
ADG5408
Figure 3. ADG5408 Pin Configuration (LFCSP)
Table 8. ADG5408 Pin Function Descriptions
Pin No.
TSSOP
LFCSP
Mnemonic
Description
1
15
A0
Logic Control Input.
2
16
EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
3
1
VSS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
4
2
S1
Source Terminal 1. This pin can be an input or an output.
5
3
S2
Source Terminal 2. This pin can be an input or an output.
6
4
S3
Source Terminal 3. This pin can be an input or an output.
7
5
S4
Source Terminal 4. This pin can be an input or an output.
8
6
D
Drain Terminal. This pin can be an input or an output.
9
7
S8
Source Terminal 8. This pin can be an input or an output.
10
8
S7
Source Terminal 7. This pin can be an input or an output.
11
9
S6
Source Terminal 6. This pin can be an input or an output.
12
10
S5
Source Terminal 5. This pin can be an input or an output.
13
11
VDD
Most Positive Power Supply Potential.
14
12
GND
Ground (0 V) Reference.
15
13
A2
Logic Control Input.
16
14
A1
Logic Control Input.
EP
Exposed Pad
The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG5408 Truth Table
A2
A1
A0
EN
On Switch
X
X
X
0
None
0
0
0
1
1
0
0
1
1
2
0
1
0
1
3
0
1
1
1
4
1
0
0
1
5
1
0
1
1
6
1
1
0
1
7
1
1
1
1
8


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