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AD5323 Datasheet(PDF) 5 Page - Analog Devices

No. de pieza AD5323
Descripción Electrónicos  2.5 V to 5.5 V, 230 uA, Dual Rail-to-Rail Voltage Output 8-/10-/12-Bit DACs
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD5323 Datasheet(HTML) 5 Page - Analog Devices

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REV. 0
AD5303/AD5313/AD5323
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD5303/AD5313/AD5323 features proprietary ESD protection circuitry, perma-
nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1, 2
(TA = +25
°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to GND . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V
VOUTA, VOUTB to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . +150
°C
16-Lead TSSOP Package
Power Dissipation . . . . . . . . . . . . . . . . . . (TJ Max – TA)/
θJA
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
PIN CONFIGURATION
TOP VIEW
(Not to Scale)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
CLR
LDAC
VDD
VREFB
VREFA
VOUTA
BUF A
BUF B
SDO
GND
DIN
SCLK
SYNC
VOUTB
PD
DCEN
AD5303/
AD5313/
AD5323
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD5303BRU
–40
°C to +105°C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5313BRU
–40
°C to +105°C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323BRU
–40
°C to +105°C
Thin Shrink Small Outline Package (TSSOP)
RU-16


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