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AD8062ARM-REEL Datasheet(PDF) 5 Page - Analog Devices

No. de pieza AD8062ARM-REEL
Descripción Electrónicos  Low-Cost, 300 MHz Rail-to-Rail Amplifiers
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AD8062ARM-REEL Datasheet(HTML) 5 Page - Analog Devices

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AD8061/AD8062/AD8063
–5–
REV. C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8061/AD8062/AD8063 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
Internal Power Dissipation2
Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . 0.8 W
SOT-23-5 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
SOT-23-6 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
µSOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W
Input Voltage (Common-Mode) (–VS – 0.2 V) to (+VS – 1.8 V)
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
±VS
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range R, RM, SOT-23-5,
SOT-23-6 . . . . . . . . . . . . . . . . . . . . . . . . –65
°C to +125°C
Operating Temperature Range . . . . . . . . . . . –40
°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . 300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air:
8-Lead SOIC Package:
θ
JA = 160
°C/W; θ
JC = 56
°C/W
5-Lead SOT-23-5 Package:
θ
JA = 240
°C/W; θ
JC = 92
°C/W
6-Lead SOT-23-6 Package:
θ
JA = 230
°C/W; θ
JC = 92
°C/W
8-Lead
µSOIC Package: θ
JA = 200
°C/W; θ
JC = 44
°C/W.
ORDERING GUIDE
Temperature
Package
Package
Branding
Model
Range
Description
Option
Information
AD8061AR
–40
°C to +85°C
8-Lead SOIC
SO-8
AD8061AR-REEL
–40
°C to +85°C
8-Lead SOIC
13-Inch Tape and Reel
AD8061AR-REEL7
–40
°C to +85°C
8-Lead SOIC
7-Inch Tape and Reel
AD8061ART-REEL
–40
°C to +85°C
5-Lead SOT-23
RT-5, 13-Inch Tape and Reel
HGA
AD8061ART-REEL7
–40
°C to +85°C
5-Lead SOT-23
RT-5, 7-Inch Tape and Reel
HGA
AD8062AR
–40
°C to +85°C
8-Lead SOIC
SO-8
AD8062AR-REEL
–40
°C to +85°C
8-Lead SOIC
13-Inch Tape and Reel
AD8062AR-REEL7
–40
°C to +85°C
8-Lead SOIC
7-Inch Tape and Reel
AD8062ARM
–40
°C to +85°C
8-Lead
µSOIC
RM-8
HCA
AD8062ARM-REEL
–40
°C to +85°C
8-Lead
µSOIC
13-Inch Tape and Reel
HCA
AD8062ARM-REEL7
–40
°C to +85°C
8-Lead
µSOIC
7-Inch Tape and Reel
HCA
AD8063AR
–40
°C to +85°C
8-Lead SOIC
SO-8
AD8063AR-REEL
–40
°C to +85°C
8-Lead SOIC
13-Inch Tape and Reel
AD8063AR-REEL7
–40
°C to +85°C
8-Lead SOIC
7-Inch Tape and Reel
AD8063ART-REEL
–40
°C to +85°C
6-Lead SOT-23
RT-6, 13-Inch Tape and Reel
HHA
AD8063ART-REEL7
–40
°C to +85°C
6-Lead SOT-23
RT-6, 7-Inch Tape and Reel
HHA
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD806x
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150
°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding a
junction temperature of 175
°C for an extended period can result
in device failure. While the AD806x is internally short circuit
protected, this may not be sufficient to guarantee that the
maximum junction temperature (150
°C) is not exceeded under
all conditions.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
AMBIENT TEMPERATURE – C
2.0
1.0
0
–50 –40 –30
70
80
90
1.5
0.5
60
50
40
30
0
–10
–20
20
10
TJ = 150 C
SOIC
SOT-23-5, -6
8-LEAD SOIC
PACKAGE
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature for AD8061/AD8062/AD8063


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