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ADG712 Datasheet(PDF) 4 Page - Analog Devices

No. de pieza ADG712
Descripción Electrónicos  CMOS Low Voltage 4 ohm Quad SPST Switches
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ADG712 Datasheet(HTML) 4 Page - Analog Devices

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ADG711/ADG712/ADG713
–4–
REV. 0
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG711/ADG712/ADG713 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +6 V
Analog, Digital Inputs
2
. . . . . . . . . . . –0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 430 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 150
°C/W
θ
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 27°C/W
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG711BR
–40
°C to +85°C
0.15" Small Outline (SOIC)
R-16A
ADG712BR
–40
°C to +85°C
0.15" Small Outline (SOIC)
R-16A
ADG713BR
–40
°C to +85°C
0.15" Small Outline (SOIC)
R-16A
ADG711BRU
–40
°C to +85°C
Thin Shrink Small Outline (TSSOP)
RU-16
ADG712BRU
–40
°C to +85°C
Thin Shrink Small Outline (TSSOP)
RU-16
ADG713BRU
–40
°C to +85°C
Thin Shrink Small Outline (TSSOP)
RU-16
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 520 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 125
°C/W
θ
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 42
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
PIN CONFIGURATION
(TSSOP/SOIC)
TOP VIEW
(Not to Scale)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
NC = NO CONNECT
IN1
D1
S1
NC
GND
S4
D4
IN4
IN2
D2
S2
VDD
NC
S3
D3
IN3
ADG711
ADG712
ADG713
Table I. Truth Table (ADG711/ADG712)
ADG711 In
ADG712 In
Switch Condition
01
ON
1
0
OFF
Table II. Truth Table (ADG713)
Logic
Switch 1, 4
Switch 2, 3
0
OFF
ON
1
ON
OFF


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