SVA-1268114

LM60/LM60-Q1

SNIS119D – MAY 2004 – REVISED NOVEMBER 2012

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APPLICATION INFORMATION

NOTE: 1/2" Square Printed Circuit Board with 2 oz. Copper Foil or Similar.

Figure 13. Printed Circuit Board Used for Heat Sink to Generate All Curves

Mounting

The LM60/LM60-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It

can be glued or cemented to a surface. The temperature that the LM60/LM60-Q1 is sensing will be within about

+0.1°C of the surface temperature that LM60/LM60-Q1's leads are attached to.

This presumes that the ambient air temperature is almost the same as the surface temperature; if the air

temperature were much higher or lower than the surface temperature, the actual temperature of the LM60/LM60-

Q1 die would be at an intermediate temperature between the surface temperature and the air temperature.

To ensure good thermal conductivity the backside of the LM60/LM60-Q1 die is directly attached to the GND pin.

The lands and traces to the LM60/LM60-Q1 will, of course, be part of the printed circuit board, which is the object

whose temperature is being measured. These printed circuit board lands and traces will not cause the

LM60/LM60-Q1's temperature to deviate from the desired temperature.

Alternatively, the LM60/LM60-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a

bath or screwed into a threaded hole in a tank. As with any IC, the LM60/LM60-Q1 and accompanying wiring and

circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may

operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as

Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM60/LM60-Q1 or

its connections.

The thermal resistance junction to ambient (

temperature due to the device power dissipation. For the LM60/LM60-Q1 the equation used to calculate the rise

in the die temperature is as follows:

Table 1 summarizes the rise in die temperature of the LM60/LM60-Q1 without any loading, and the thermal

resistance for different conditions.

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