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TPS27082L Datasheet(PDF) 7 Page - Texas Instruments |
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TPS27082L Datasheet(HTML) 7 Page - Texas Instruments |
7 / 19 page TPS27082L www.ti.com SLVSBR5 – DECEMBER 2012 Improving Package Thermal Performance The package θJA value under standard conditions on a High-K board is available in the Dissipation Rating Table. θJA value depends upon the PC board layout. An external heat sink and/or a cooling mechanism like a cold air fan can help reduce θJA and thus improving device thermal capability. Refer to TI’s design support web page at www.ti.com/thermal for a general guidance on improving device thermal performance. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: TPS27082L |
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