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TPS62732DRYT Datasheet(PDF) 2 Page - Texas Instruments

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No. de pieza TPS62732DRYT
Descripción Electrónicos  Step Down Converter with Bypass Mode for Ultra Low Power Wireless Applications
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

TPS62732DRYT Datasheet(HTML) 2 Page - Texas Instruments

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TPS62732, TPS62733
TPS62730
SLVSAC3C – MAY 2011 – REVISED DECEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
Automatic Bypass Mode Transition
Thresholds VIT BYP
PACKAGE
PART
TA
OUTPUT VOLTAGE [V]
ORDERING(1)
NUMBER
MARKING
VIT BYP [V]
VIT BYP [V]
VIT BYP [mV]
rising VIN
falling VIN
hysteresis
TPS62730
2.10
2.25
2.20
50
TPS62730DRY
RP
TPS62731 (2)
2.05
2.2
2.15
50
TPS62731DRY
RQ
TPS62732
1.90
2.10
2.05
50
TPS62732DRY
RR
–40°C to
85°C
TPS62733
2.3
2.48
2.41
70
TPS62733DRY
YA
TPS62734 (2)
2.10
2.28
2.23
50
TPS62734DRY
SL
TPS62735 (2)
2.10
2.33
2.23
100
TPS62735DRY
SM
(1)
The DRY package is available in tape on reel. See section package option addendum for package quantities.
(2)
Device status is product preview, contact TI for more details / samples
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Voltage range(2)
VIN, SW, VOUT
–0.3
4.2
V
ON/BYP, STAT
–0.3
VIN +0.3, ≤4.2
V
Temperature range
Operating junction temperature, TJ
–40
125
°C
Storage, Tstg
–65
150
°C
ESD rating(3)
Human Body Model - (HBM)
2
kV
Machine Model (MM)
150
V
Charge Device Model - (CDM)
1
kV
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to network ground terminal.
(3)
ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
THERMAL METRIC(1)
DRY / 6 PINS
UNITS
θJA
Junction-to-ambient thermal resistance
293.8
θJCtop
Junction-to-case (top) thermal resistance
165.1
θJB
Junction-to-board thermal resistance
160.8
°C/W
ψJT
Junction-to-top characterization parameter
27.3
ψJB
Junction-to-board characterization parameter
159.6
θJCbot
Junction-to-case (bottom) thermal resistance
65.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Links: TPS62732 TPS62733 TPS62730


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