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02011J4R7AAWTR Datasheet(PDF) 17 Page - AVX Corporation

No. de pieza 02011J4R7AAWTR
Descripción Electrónicos  High purity of electrodes for very low and repeatable
Download  19 Pages
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Fabricante Electrónico  AVX [AVX Corporation]
Página de inicio  http://www.avx.com
Logo AVX - AVX Corporation

02011J4R7AAWTR Datasheet(HTML) 17 Page - AVX Corporation

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22
1
Accu-F
® / Accu-P®
Application Notes
GENERAL
Accu-F
®
and Accu-P
®
SMD capacitors are designed for
soldering to printed circuit boards or other substrates. The
construction of the components is such that they will with-
stand the time/temperature profiles used in both wave and
reflow soldering methods.
CIRCUIT BOARD TYPE
The circuit board types which may be used with Accu-F
® and
Accu-P
® are as follows:
Accu-F
®: All flexible types of circuit boards
(eg. FR-4, G-10).
Accu-P
®: All flexible types of circuit boards
(eg. FR-4, G-10) and also alumina.
For other circuit board materials, please consult factory.
HANDLING
SMD capacitors should be handled with care to avoid damage
or contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly recom-
mended for individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized. For
automatic equipment, taped and reeled product gives the
ideal medium for direct presentation to the placement
machine.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good
joints and minimize component movement during reflow
soldering. Pad designs are given below for both wave and
reflow soldering.
The basis of these designs is:
a. Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but
it is not advisable to go below this.
b. Pad overlap 0.5mm beneath large components. Pad
overlap about 0.3mm beneath small components.
c. Pad extension of 0.5mm for reflow of large components
and pad extension about 0.3mm for reflow of small com-
ponents. Pad extension about 1.0mm for wave soldering.
WAVE SOLDERING
DIMENSIONS: millimeters (inches)
1.2
(0.047)
3.1
(0.122)
0.8
(0.031)
0.7
(0.028)
1.2
(0.047)
0.8
(0.031)
2.1
(0.083)
0.55
(0.022)
0.5
(0.020)
0.8
(0.031)
1.06
(0.042)
0.34
(0.013)
0.26
(0.010)
0.40
(0.016)
0.40
(0.016)
3.1
(0.122)
0.8
(0.031)
0.6
(0.024)
1.25
(0.049)
1.25
(0.049)
1.5
(0.059)
1.5
(0.059)
1.0
(0.039)
4.0
(0.157)
1.25
(0.049)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
5.0
(0.197)
2.5
(0.098)
0603
Accu-F
®
0402
Accu-P
®
0201
Accu-P
®
0603
Accu-P
®
0805
Accu-F
®
Accu-P
®
1210
Accu-P
®
REFLOW SOLDERING
DIMENSIONS: millimeters (inches)
0.6
(0.024)
1.7
(0.068)
0.55
(0.022)
0.5
(0.020)
0.6
(0.024)
0.8
(0.031)
2.3
(0.091)
0.6
(0.024)
0.85
(0.033)
0.85
(0.033)
3.0
(0.118)
1.25
(0.049)
1.0
(0.039)
1.0
(0.039)
1.0
(0.039)
2.5
(0.098)
4.0
(0.157)
1.0
(0.039)
2.0
(0.079)
1.0
(0.039)
0402
Accu-P
®
0.78
(0.030)
0.34
(0.013)
0.26
(0.010)
0.26
(0.010)
0.26
(0.010)
0201
Accu-P
®
0.8
(0.031)
2.3
(0.091)
0.7
(0.028)
0.8
(0.031)
0.8
(0.031)
0603
Accu-F
®
0603
Accu-P
®
0805
Accu-F
®
Accu-P
®
1210
Accu-P
®


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