AD9508PCBZ datasheet(10/40 Pages) AD

No. de pieza	AD9508PCBZ

Descripción Electrónicos	1.65 GHz Clock Fanout Buffer with Output Dividers and Delay Adjust

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AD9508

Data Sheet

Rev. A | Page 10 of 40

ABSOLUTE MAXIMUM RATINGS

Table 10.

Parameter

Rating

Supply Voltage (VDD)

3.6 V

Maximum Digital Input Voltage

−0.5 V to VDD + 0.5 V

CLK and CLK

−0.5 V to VDD + 0.5 V

Maximum Digital Output Voltage

−0.5 V to VDD + 0.5 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

The following equation determines the junction temperature on

the application PCB:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer at

the top center of the package.

ΨJT is the value as indicated in Table 11.

PD is the power dissipation.

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order approxi-

mation of TJ by the following equation:

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of θJB are provided for package comparison and PCB

design considerations.

THERMAL CHARACTERISTICS

Thermal characteristics established using JEDEC51-7 and

JEDEC51-5 2S2P test boards.

Table 11. Thermal Characteristics, 24-Lead LFCSP

Symbol

Thermal Characteristic

(JEDEC51-7 and JEDEC51-5 2S2P

Test Boards1)

Value2

Unit

θJA

Junction-to-ambient thermal

resistance per JEDEC JESD51-2 (still

air)

43.5

°C/W

θJMA

Junction-to-ambient thermal

resistance, 1.0 m/sec airflow per

JEDEC JESD51-6 (moving air)

40

°C/W

θJMA

Junction-to-ambient thermal

resistance, 2.5 m/sec airflow per

JEDEC JESD51-6 (moving air)

38.5

°C/W

θJB

Junction-to-board thermal

resistance per JEDEC JESD51-8 (still

air)

16.2

°C/W

θJC

Junction-to-case thermal resistance

(die-to-heat sink) per MIL-STD-883,

Method 1012.1

7.1

°C/W

ΨJT

Junction-to-top-of-package

characterization parameter per

JEDEC JESD51-2 (still air)

0.33

°C/W

1 The exposed pad on the bottom of the package must be soldered to ground

(VSS) to achieve the specified thermal performance.

2 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal

performance for actual applications requires careful inspection of the

conditions in the application to determine if they are similar to those

assumed in these calculations.

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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