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74LCX2244 Datasheet(PDF) 1 Page - Fairchild Semiconductor

No. de Pieza. 74LCX2244
Descripción  Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs with 26ohm Series Resistors in the Outputs
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Fabricante  FAIRCHILD [Fairchild Semiconductor]
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74LCX2244 Datasheet(HTML) 1 Page - Fairchild Semiconductor

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© 2003 Fairchild Semiconductor Corporation
October 1995
Revised May 2003
Low Voltage Buffer/Line Driver with 5V Tolerant Inputs
and Outputs with 26
Ω Series Resistors in the Outputs
General Description
The LCX2244 contains eight non-inverting buffers with
3-STATE outputs. The device may be employed as a mem-
ory address driver, clock driver and bus-oriented transmit-
ter/receiver. The LCX2244 is designed for low voltage
(2.5V or 3.3V) VCC applications with capability of interfac-
ing to a 5V signal environment. The 26
Ω series resistors
help reduce output overshoot and undershoot.
The LCX2244 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
s 5V tolerant inputs and outputs
s 2.3V to 3.6V VCC specifications provided
s 7.5 ns tPD max (VCC = 3.3V) 10 µA ICC max
s Power down high impedance inputs and outputs
s 26
Ω-series resistors in the outputs
s Supports live insertion/withdrawal (Note 1)
±12 mA output drive (V
CC = 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds 500 mA
s ESD performance:
Human body model
> 2000V
Machine model
> 200V
s Leadless DQFN package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Order Number
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241,
2.5 x 4.5mm
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

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