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74LCX574SJ Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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74LCX574SJ Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 14 page ©2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com February 2006 74LCX574 Rev. 2.0.0 74LCX574 Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs Features ■ 5V tolerant inputs and outputs ■ 2.3V–3.6V VCC specifications provided ■ 7.5ns tPD max (VCC = 3.3V), 10µA ICC max ■ Power down high impedance inputs and outputs ■ Supports live insertion/withdrawal1 ■ ±24mA output drive (V CC = 3.0V) ■ Implements patented noise/EMI reduction circuitry ■ Latch-up performance exceeds JEDEC 78 conditions ■ ESD performance – Human body model > 2000V – Machine model > 200V ■ Leadless Pb-Free DQFN package General Description The LCX574 is a high-speed, low power octal flip-flop with a buffered common Clock (CP) and a buffered common Output Enable (OE). The information presented to the D inputs is stored in the flip-flops on the LOW-to- HIGH Clock (CP) transition. The LCX574 is functionally identical to the LCX374 except for the pinouts. The LCX574 is designed for low voltage applications with capability of interfacing to a 5V signal environment. The LCX574 is fabricated with an advanced CMOS tech- nology to achieve high speed operation while maintain- ing CMOS low power dissipation. Ordering Information Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Pb-Free package per JEDEC J-STD-020B. Notes: 1. To Ensure the high impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value of the resistor is determined by the current-sourcing capability of the driver. 2. DQFN package available in Tape and Reel only 3. “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only. Order Number Package Number Package Description 74LCX574WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LCX574WM_NL3 M20B Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LCX574SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCX574BQX2 MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm 74LCX574MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LCX574MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LCX574MTC_NL3 MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide |
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