© 2005 Fairchild Semiconductor Corporation

DS012016

www.fairchildsemi.com

September 1999

Revised March 2005

74LVT374 • 74LVTH374

Low Voltage Octal D-Type Flip-Flop

with 3-STATE Outputs

General Description

The LVT374 and LVTH374 are high-speed, low-power

octal D-type flip-flops featuring separate D-type inputs for

each flip-flop and 3-STATE outputs for bus-oriented appli-

cations. A buffered Clock (CP) and Output Enable (OE) are

common to all flip-flops.

The LVTH374 data inputs include bushold, eliminating the

need for external pull-up resistors to hold unused inputs.

These octal flip-flops are designed for low-voltage (3.3V)

interface to a 5V environment. The LVT374 and LVTH374

are fabricated with an advanced BiCMOS technology to

achieve high speed operation similar to 5V ABT while

maintaining low power dissipation.

Features

s Input and output interface capability to systems at

s Bus-Hold data inputs eliminate the need for external

pull-up resistors to hold unused inputs (74LVTH374),

also available without bushold feature (74LVT374).

s Live insertion/extraction permitted

s Power Up/Down high impedance provides glitch-free

bus loading

s Outputs source/sink

32 mA/64 mA

s Functionally compatible with the 74 series 374

s Latch-up performance exceeds 500 mA

s ESD performance:

Human-body model

! 2000V

Machine model

! 200V

Charged-device model

! 1000V

Ordering Code:

Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.

Pb-Free package per JEDEC J-STD-020B.

Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.

Logic Symbols

IEEE/IEC

Order Number

Package

Package Description

Number

74LVT374WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

74LVT374SJ

M20D

Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

74LVT374MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

74LVTH374WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

74LVTH374SJ

M20D

Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

74LVTH374MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

74LVTH374MTCX_NL

(Note 1)

MTC20

Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide