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LM1117IMP-3.3 Datasheet(PDF) 3 Page - Texas Instruments |
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LM1117IMP-3.3 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 32 page NOT CONNECTED VOUT VOUT VOUT 1 2 3 4 8 7 6 5 ADJ/GND VIN VIN VIN VOUT LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 Figure 6. DDPAK/TO-263 Side View When using the WSON package Pins 2, 3 & 4 must be connected together and Pins 5, 6 & 7 must be connected together Figure 7. WSON Top View These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Maximum Input Voltage (VIN to GND) 20V Power Dissipation(3) Internally Limited Junction Temperature (TJ) (3) 150°C Storage Temperature Range -65°C to 150°C TO-220 (T) Package 260°C, 10 sec Lead Temperature SOT-223 (IMP) Package 260°C, 4 sec ESD Tolerance(4) 2000V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board. (4) For testing purposes, ESD was applied using human body model, 1.5k Ω in series with 100pF. OPERATING RATINGS (1) Input Voltage (VIN to GND) 15V LM1117-N 0°C to 125°C Junction Temperature Range (TJ) (2) LM1117I −40°C to 125°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM1117-N LM1117I |
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